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Wire bonding 자동 전단력 검사를 위한 wire의 3차원 위치 측정 시스템 개발
고국원(Kuk Won Ko),김동현(Dong Hyun Kim),이지연(Jiyeon Lee),이상준(Sangjoon Lee) 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.21 No.12
The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pinhole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.
반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화
고국원(Kuk Won Ko),심재환(Jae Hwan Sim),김민영(Min Young Kim) Korean Society for Precision Engineering 2013 한국정밀공학회지 Vol.30 No.7
The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an ‘on-the-fly’ imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.
웨이퍼 핸들링을 위한 collet의 외관 비전 검사 장치 개발
고국원(Kuk Won Ko),이지연(Ji Yeon Lee) 한국생산제조학회 2023 한국생산제조학회지 Vol.32 No.1
In semiconductor manufacturing, small and precise tools such as collets are used during the assembly process to control and improve product quality. Monitoring the quality of the collet, such as its shape, size, and hole, is crucial for ensuring high reliability when picking up a cut wafer during the semiconductor packaging process. In this study, we propose a defect detection algorithm using image processing techniques. The application was implemented in a visual C++ environment, which enables motion control, image acquisition control, and the execution of image processing algorithms. The test and analysis of the collet inspection system yielded a defect detection rate of 99.3%.