플라즈마를 활용한 선택적 표면 개질과 무전해 동도금법을 이용한 플렉서블 회로 패턴 형성 및 접합력 향상에 관한 연구

다국어 초록 (Multilingual Abstract)

Flexible circuits are widely used in mobile devices and wearable devices because they are lightweight, compact and high durability against repetitive bending. Recently, there has been growing interests in fabrication of high durability and low-cost flexible circuits as the wearable electronics market grows sharply.
In general, flexible circuits are formed by using lithography process after coating the polymer substrate with copper. However these processes use a large amount of harmful chemicals and need many manufacturing steps. Moreover, the importance about adhesion strength and fatigue properties has been highlighted as the market demands high mechanical and electrical performances of flexible circuits.
In this study, a directly formed copper circuit was fabricated with using plasma and electroless copper deposition and also the effects on the adhesion strength, the fatigue properties and fracture mechanisms of fabricated Cu/PET composite films depending on the change of nanostructures formed by the plasma treatment were discussed.

목차 (Table of Contents)

• 1. 서 론 1
• 2. 문헌연구와 이론적 배경 4
• 2-1. 플라즈마 4
• 2-2. 금속염 용액을 이용한 금속 피막 형성 5
• 2-3. 젖음성 이론 6
• 2-3-1. Young’s equation 6
• 2-3-2. Wenzel equation 8
• 2-3-3. Cassie-Baxter equation 9
• 2-4. 접합이론 10
• 2-4-1. 기계적 접합 10
• 2-4-2. 정전기 이론 11
• 2-4-3. 약한 계면층 이론 11
• 2-4-4. 흡착 이론 12
• 2-4-5. 확산 이론 12
• 2-4-6. 화학결합 이론 13
• 2-5. Crazing 14
• 3. 실험방법 19
• 4. 결과 및 고찰 24
• 4-1. 젖음성 차이를 이용한 패턴도금 24
• 4-2. 나노구조 형상에 따른 접합력 및 굽힘 피로 36
• 5. 결 론 53
• * 참고문헌 55
• Abstract 61