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- 저자 : Suhas Sitaram Joshi (검색결과 2 건)
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Deepak Marla,Suhas Sitaram Joshi,Vishal Barde 한국정밀공학회 2013 International Journal of Precision Engineering and Vol. No.
An analytical model to predict the temperature distribution and ablation depth in excimer laser ablation process by solving onedimensional heat conduction equation has been proposed. The model takes into account aspects like temperature dependent thermal properties for polycarbonate material and re-solidification during pulse off-time. The effects of fluence and number of pulses with and without consideration to the temperature dependent thermal conductivity and pulse delay have been investigated. It is observed that consideration to temperature dependent thermal conductivity and re-solidification during pulse ‘off-time’ results in an appreciable improvement in the accuracy of ablation depth prediction and the error being within ± 0.8 μm.
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Numerical Simulation of Micro Hot Embossing of Polymer Substrate
Jyoti Shankar Jha,Suhas Sitaram Joshi 한국정밀공학회 2012 International Journal of Precision Engineering and Vol. No.
Micro hot embossing, one of the important steps in the LIGA process is aimed at increasing the scale of production. The process involves: molding- in which metallic mold is pressed into the polymer, cooling- in which mold and the polymer are held together and demolding - where in the mold is separated from the polymer. In the past, these steps in a micro hot embossing process are modelled independently. As the parameters in each of these stages influence the final product quality, the simulations were performed using DEFORM 3D and by transferring the strain history from one stage to another. The final product quality thus is a function of the preceding quality in each stage. The parametric analysis shows that, at lower level of molding speed (0.01 mm/min - 0.1 mm/min)and lower level of molding temperature (105℃-115℃), complete mold filling was evident. In the cooling stage, the difference between the molding and demolding temperature governs contact stresses and thermal shrinkage. At the same time, in the demolding stage,lower rate of demolding ensures lower residual stresses in the micro components formed. Experimental validation of the results shows that the predicted results agree fairly with the simulated values.
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