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Quarter Micron Resolution with Stabilized Deep UV Photoresist on 2 Micrascan 11
Nunes, Ronald W.,Welsh, Kevin M.,Spinillo, Gary T. 대한전자공학회 1993 ICVC : International Conference on VLSI and CAD Vol.3 No.1
IBM's DUV chemically amplified photoresists, APEX M & E were exposed on a Silicon Valley Group Lithographic Systems (SVGL) Micrascan II deep UV step and scan tool interfaced to an SVG true. Resolution to 0.25 um was obtained on a bare silicon substrate with a bottom antireflective coating. These results illustrate the doselfocus windows for nested liner as well as the resolution linearity of the resist. This paper also compares the stability of APEX M c E during delays between expose and past expose bake (PEB) as well as effects clue to other process variables.