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- 저자 : Rohit T. Mathew (검색결과 1 건)
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Javed S. Ibrahim ,Rohit T. Mathew,M. J. N. V. Prasad,K. Narasimhan 대한금속·재료학회 2022 METALS AND MATERIALS International Vol.28 No.10
Owing to high heat flux ability and good mechanical strength, copper has been used for micro-electro-mechanical systems(MEMS) components with dimensions in micrometers processed by electrochemical methods. In the present study, finegrained copper foils of different thicknesses and grain sizes produced by pulsed electrodeposition under different controlledcurrent densities were used to investigate the effect of total number of grains across thickness of foil on its tensile responseand formability. For a comparative study, commercially available rolled Cu foils were also used. Vacuum annealing wasemployed to obtain a wide range of fully recrystallized grain sizes within same thickness of the foils. Detailed microstructuralcharacterization was carried out using scanning electron microscope attached with electron backscattered diffraction detector. The foils were subjected to uniaxial tensile testing and formability testing using a miniaturized Nakazima test setup. Asanticipated, finer the grain size higher was the yield strength. However, the strength of copper reduced with decreasing thetotal number of grains across thickness of the foil. The electrodeposited Cu foil exhibited relatively higher strength levelsbut reduced tensile ductility along with decreased strain hardening ability compared to the fully recrystallized Cu foils havingsimilar grain sizes. Furthermore, the number of grains across thickness and the prior history of foils played significantrole on the shape and trend in variation of the forming limit curve of Cu. An α-fiber (< 110 >) texture evolved in Cu duringdeformation and its volume fraction strengthened under biaxial deformation conditions.
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