http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Ivan V. Ivanov,Daria V. Lazurenko,Andreas Stark,Florian Pyczak,Alexander Thömmes,Ivan A. Bataev 대한금속·재료학회 2020 METALS AND MATERIALS International Vol.26 No.1
This paper presents a comparison between the “classical” and the modified Williamson–Hall and Warren–Averabach methodsapplied to an analysis of the microstructure of -titanium. The microstructural parameters of cold-rolled titanium specimenswere retrieved from analysis of the X-ray diffraction (XRD) peaks. The high-quality XRD patterns were received at the P07beamline (The High Energy Materials Science) at the German electron synchrotron. The dependence of the crystallite size,the inhomogeneous microstrains, the average dislocation density, the dislocation cut-off radius and some other parameterson the plastic strain were estimated. The results clearly indicate that, due to the consideration of the dislocation contrasteffect, the modified models are a much better fit to the experimental data in comparison with the “classical” models. Theresults of hardness and corrosion resistance measurements of Ti samples can be explained based on the results obtainedfrom the XRD analysis.
Dina V. Dudina,Vyacheslav I. Mali,Alexander G. Anisimov,Natalia V. Bulina,Michail A. Korchagin,Oleg I. Lomovsky,Ivan A. Bataev,Vladimir A. Bataev 대한금속·재료학회 2013 METALS AND MATERIALS International Vol.19 No.6
We present several possible microstructure development scenarios in Ti3SiC2-Cu composites during mechanical milling and Spark Plasma Sintering (SPS). We have studied the effect of in situ consolidation during milling of Ti3SiC2 and Cu powders and melting of the Cu matrix during the SPS on the hardness and electrical conductivity of the sintered materials. Under low-energy milling, (3-5) vol.%Ti3SiC2-Cu composite particles of platelet morphology formed, which could be easily SPS-ed to 92-95% relative density. Under high-energy milling, millimeter-scale (3-5) vol.%Ti3SiC2-Cu granules formed as a result of in situ consolidation and presented a challenge to be sintered into a bulk fully dense sample; the corresponding SPS-ed compacts demonstrated a finer-grained Cu matrix and more significant levels of hardening compared to composites of the same composition processed by low-energy milling. The 3 vol.% Ti3SiC2-Cu in situ consolidated and Spark Plasma Sintered granules showed an extremely high hardness of 227 HV. High electrical conductivity of the Ti3SiC2-Cu composites sintered from the granules was an indication of efficient sintering of the granules to each other. Partial melting of the Cu matrix, if induced during the SPS, compromised the phase stability and uniformity of the microstructure of the Ti3SiC2-Cu composites and thus it is not to be suggested as a pathway to enhanced densification in this system.