http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Hongwen He,Liqiang Cao,Lixi Wan,Haiyan Zhao,Guangchen Xu,Fu Guo 대한금속·재료학회 2012 ELECTRONIC MATERIALS LETTERS Vol.8 No.4
The electromigration test was conducted in Cu/Sn-58Bi/Cu solder joint with high current density of 104 A/cm2. Results showed that a large number of whiskers with natural weed appearance were observed at the cathode side in such a short current stressing time. Furthermore, some secondary whiskers were attached to the primary whiskers, which has never been reported before. We presumed the vapor-solid (VS) mechanism to explain the oxide whiskers growth, which was quite different from the traditional theory that the compressive stress took on the driving force. In conclusion, due to the over-Joule heating effect, the metal oxide whiskers were synthesized in bulk quantities by thermal evaporation of Sn oxide and Bi oxide.