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Multiwire-electrical discharge machining process for silicon wafering for photovoltaics
Lee Wooyoung,Hirsch Jens,Jang Boyun 한국물리학회 2023 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.82 No.1
Multiwire-electrical discharge machining system and process has been developed, and Si wafers with dimension of 25×25×0.5 mm were obtained with 15 wires. So far, 15 wires are the maximum number to saw Si within voltage range we can control. The saw damages such as microstructural defects and metallic impurities were observed, and various removal methods such as plasma processing and chemical cleaning were studied. Typical defects were grooves, holes, craters and metallic impurities from consumable materials in process. Plasma processing and texturing were efective to remove microstructural defects, but need further research to completely remove micro holes on surface. For removal of metallic impurities, chemical cleaning by treatment was the most efective way. Through this study, we found requirements of further developments, such as wire tension control, replacement of wire with diferent materials, and so on. Nevertheless, we found the possibility of our technology to apply for Si wafering process with industrial level.