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ALUMINUM BIAS SPUTTERING FOR FILM COVERAGE IMPROVEMENT
Kobayashi.Shigeru,Shimamura, Hideaki,Sakata, Masao,Fujita, Shouyou,Yajima, Akira,Saito, Hiroshi,Tateishi, Hideki,Sasaki, Shinji 대한전자공학회 1989 ICVC : International Conference on VLSI and CAD Vol.1 No.1
A filter was installed between the sputtering target and the substrate so as to reduce the aluminum deposition arriving with a shallow angle at the substrate in order to study the step coverage improvement by the bias application. It is deduced that the aluminum flowage occurs so that the surface energy is minimized around the via hole. Aluminum films deposited with the pulsed biasing were characterized in which the possible microstructual damage by argon bombardment is to be minimized. This biasing technique should provide with a better process for the step coverage improvement. A sputtering cathode was developed for aluminum bias sputtering which has a substrate current capability as high as 2A for a 5 inch wafer at the substrate voltage around-50V.
Hideaki Kawano,Akito Shimamura,Hiroshi Maeda,Junichi Fukuyo,Norikazu Ikoma 제어로봇시스템학회 2009 제어로봇시스템학회 국제학술대회 논문집 Vol.2009 No.8
For recognition of decorated characters through existing optical character recognition system (OCR), structure extraction of the decorated characters is required. Omachi et al. proposed a structure extraction method for these characters. However, characters including both thin lines and thick lines simultaneously tend to fail the extraction of structure. To overcome the performance in Omachi’s method, we have proposed another method based on graph spectral decomposition. In the previous work, we showed applicability of the proposed method to wider range of decorated characters. However, selection criterion among decomposed components for obtaining good results have not been clarified. In this paper, we propose a new criterion to select components in the graph spectral decomposition framework for structure extraction. Experimental results show the validity of the criterion.