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M.Yu. Kameneva,L.P. Kozeeva,A.G. Blinov,N.V. Kuratieva,V.E. Fedorov 한양대학교 세라믹연구소 2009 Journal of Ceramic Processing Research Vol.10 No.1
Single-phase polycrystalline samples of Sm1Ba2Cu3O6+y (123 SmSS) with x = 0.0-0.7 were prepared in air by solid state synthesis with precisely controlled technological parameters (the heating and cooling rates, temperature-time regime). Microstructural, structural, and superconducting properties were studied. It is shown that cation stoichiometric samples of Sm1Ba2Cu3O6+y with a high temperature superconducting transition (89-92K) can be obtained in air. By increasing the Sm/Ba ratio in Sm1+xBa2-xCu3O6+y the orthorhombic-to-tetragonal phase transition is observed. The orthorhombic phase loses its stability at x > 0.125, and the solid solution decomposes by a spinodal mechanism to form layered microstructures with a variable Sm/ Ba ratio. The data obtained are useful for understanding the mechanisms of the formation of possible vortex pinning centers in Ln1+xBa2-xCu3O6+y phases. Single-phase polycrystalline samples of Sm1Ba2Cu3O6+y (123 SmSS) with x = 0.0-0.7 were prepared in air by solid state synthesis with precisely controlled technological parameters (the heating and cooling rates, temperature-time regime). Microstructural, structural, and superconducting properties were studied. It is shown that cation stoichiometric samples of Sm1Ba2Cu3O6+y with a high temperature superconducting transition (89-92K) can be obtained in air. By increasing the Sm/Ba ratio in Sm1+xBa2-xCu3O6+y the orthorhombic-to-tetragonal phase transition is observed. The orthorhombic phase loses its stability at x > 0.125, and the solid solution decomposes by a spinodal mechanism to form layered microstructures with a variable Sm/ Ba ratio. The data obtained are useful for understanding the mechanisms of the formation of possible vortex pinning centers in Ln1+xBa2-xCu3O6+y phases.
The 72-h WEBT microvariability observation of blazar S5 0716 + 714 in 2009
Bhatta, G.,Webb, J. R.,Hollingsworth, H.,Dhalla, S.,Khanuja, A.,Bachev, R.,Blinov, D. A.,Bö,ttcher, M.,Bravo Calle, O. J. A.,Calcidese, P.,Capezzali, D.,Carosati, D.,Chigladze, R.,Collins, A.,Colo EDP Sciences 2013 Astronomy and astrophysics Vol.558 No.-
Mounting Uncased Multi-connection Integrated Circuits with Ball Contacts on Flexible Polyimide Board
Yu. Dolgovykh,A. Pogalov,G. Blinov,S. Timoshenkov,N. Korobova 한국정보통신학회 2014 2016 INTERNATIONAL CONFERENCE Vol.6 No.1
One of the modern design and technological solutions for micro-miniaturization of electronic products is the development of multichip modules based on the technology of assembly and installation unpackaged chips on a flexible board. Technology of uncased multi-connection integrated circuits (ICs) creating with ball contacts was propose. Ball contacts were formed on the contact areas of the crystal. Crystal after certification was mounted on a flexible circuit, where hemispherical contact pads have been formed