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RISS 인기검색어
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- 저자 : 임성봉(Seong-Bong Yim) (검색결과 3 건)
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이주열(Joo-Yul Lee),임성봉(Seong-Bong Yim),황양진(Yang Jin Hwang),이규환(Kyu Hwan Lee) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.6
The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.
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구연산 기반 구리-니켈 합금도금에 대한 분광학적/전기화학적 특성 연구
이주열(Joo-Yul Lee),임성봉(Seong-Bong Yim),김만(Man Kim),정용수(Yongsoo Jeong) 한국표면공학회 2011 한국표면공학회지 Vol.44 No.3
We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UVVisible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of Ni<SUP>2+</SUP>-citrate pair was completed at lower solution pH than Cu<SUP>2+</SUP>-citrate pair and was affected by the coexistent Cu<SUP>2+</SUP> ions, while the complexation between Cu<SUP>2+</SUP> ions and citrate was not sensitive to the presence of Ni<SUP>2+</SUP> ions. Also, the electron transfer from cathode to Cu<SUP>2+</SUP>-citrate and Ni<SUP>2+</SUP>-citrate was hindered by strong complexation between Cu<SUP>2+</SUP>/Ni<SUP>2+</SUP> ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of Cu<SUP>2+</SUP> ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.
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유기물 첨가제가 마이크로 패턴 구리 전주 도금에 미치는 영향 연구
이주열(Joo-Yul Lee),김만(Man Kim),이규환(Kyu Hwan Lee),임성봉(Seong-Bong Yim),이종일(Jong Il Lee) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.1
The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a role as a n accelerator and TU as an inhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ㎛-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.
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