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오늘 본 자료
Notebook Palm Rest 온도 저감에 관한 수치 & 실험적 연구
김예용(Ye Yong Kim),고기탁(Ki Tak Ko),이혁기(Hyuk Ki Lee),이성호(Sung Ho Lee) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
Nevertheless CPU TDP(Thermal Design Power) increases dramatically every year, customers require lighter, thinner, and cooler notebook. Because platform TDP increases by over 25% every year, thermal view point is focused on platform cooling as well as CPU cooling. Because of this TDP pattern, new phenomena which were neglected in the past start to appear. Among these phenomena, this paper focus on the notebook palm rest. Because palm rest is where people hand, exactly palm, is laid, this part is considered as very important to customer in terms of sensitivity. In this paper, some technologies are introduced from past technology including aluminum or copper plate and heat pipe to new technology including plate heat pipe.