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이승우(S. W. Lee),송준엽(J. Y. Song),이화기(H. K. Lee) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
Compound semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study, we design data acquisition system of compound semiconductor fabrication that has monitoring and control of process. The developed DAS is consisted of key-in system inputted by operator and automatic acquisition system by GEM protocol. And we implemented them in the actual compound semiconductor. It is expected that using developed system would offer precise process information to buyer, reduce a lead-time, and obey a due-dates and so on.
이승우(S. W. Lee),김동훈(D. H. Kim),임선종(S. J. Lim),송준엽(J. Y. Song),이화기(H. K. Lee) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
In order to implement Artificial Intelligence, various technologies have been widely used. Artificial Intelligence is applied for many industrial product and machine tools are the center of manufacturing devices in intelligent manufacturing system. The purpose of this paper is to present the construction of Rule Base for knowledge structure that is applicable to machine tools. This system is that decision whether to act in accordance with machine status is support system. It constructs Rule Base of knowledge used of machine tools. The constructed Rule Base facilitates the effective operation and control of machine tools and will provide a systematic way to integrate the expert"s knowledge that will apply Intelligent Machine Tools.
이승우(S. W. Lee),한승우(S. W. Han),김정실(J. S. Kim),송준엽(J. Y. Song),김완두(W. D. Kim) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
The reliability evaluation and analysis for general electronic components are required to guarantee in quality and in efficiency. Reliability prediction of the interface card, which is used in the CNC controller of machine tools, was carried out using MIL-HDBK-217F and PRISM database. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for the weak components before they are used.