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75W급 LED 가로등 모듈의 방열판 최적화와 열특성 분석
이승민(Seung-Min Lee),이세일(Se-Il Lee),양종경(Jong-Kyung Yang),이종찬(Jong-Chan Lee),박대희(Dae-Hee Park) 대한전기학회 2010 전기학회논문지 Vol.59 No.3
In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in 1 [㎥] box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of 47.37 [℃] and thermal resistance of 0.48407 [W/℃]. In thermal flow simulation, the temperature of heatsink decreased from 51.54 [℃] to 51.51 [℃] and the temperature of heatsink by the time in real measurement decreased from 47.03 [℃] to 46.87 [℃]. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux