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파손압력모델의 경계조건을 이용한 매설배관의 파손확률 평가
이억섭(Ouk Sub Lee),김의상(Eui Sang Kim),김동혁(Dong Hyeok Kim) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.4
This paper presents the effect of boundary condition of failure pressure model for buried pipelines on<br/> failure prediction by using a failure probability model. The first order Taylor series expansion of the limit<br/> state function is used in order to estimate the probability of failure associated with various corrosion defects<br/> for long exposure periods in years. A failure pressure model based on a failure function composed of failure<br/> pressure and operation pressure is adopted for the assessment of pipeline failure. The effects of random<br/> variables such as defect depth, pipe diameter, defect length, fluid pressure, corrosion rate, material yield stress,<br/> material ultimate tensile strength and pipe thickness on the failure probability of the buried pipelines are<br/> systematically studied by using a failure probability model for the corrosion pipeline.
이억섭(Ouk-Sub Lee),김의상(Eui-Sang Kim) Korean Society for Precision Engineering 2004 한국정밀공학회지 Vol.21 No.2
The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.