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열화상기술을 이용한 모멘트 변화에 따른 피로균열진전 연구
김경석,정현철,박찬주,정덕운,장호섭,Kim, Kyeong-Suk,Jung, Hyun-Chul,Pack, Chan-Joo,Jung, Duk-Woon,Chang, Ho-Sub 한국생산제조학회 2010 한국생산제조학회지 Vol.10 No.6
The objective of this study is to propose an effective method for measurement and analysis of fatigue crack. A technique that can measure the statue of fatigue crack propagation fast and correctly for enhancing safety of constructions and securing reliability is necessary. Moreover, the crack propagation behavior characteristics evaluation technique has to be developed using this technique. In this paper, fatigue crack was caused via the fatigue experiment with repeated load on the CT specimen that is made up of STS304. Fatigue crack propagation was measured by tracing the position of the maximum temperature according to the cycles using infrared thermography. The crack growth characteristics was evaluated by applying the moment values on the measuring area to the measured value. As a result of this study, the possibility that the infrared thermography could be applied to measure the fatigue crack was identified. Moreover, it was identified that fatigue crack propagation have a relationship with the moment value of construction.
ESPI를 이용한 자외선조사량에 따른 폴리머애자의 탄성계수 변화 연구
김경석,김동수,장호섭,박찬주,장완식,정현철,Kim, Kyeong-Suk,Kim, Dong-Soo,Chang, Ho-Sub,Pack, Chan-Joo,Jang, Wan-Sik,Jung, Hyun-Chul 한국생산제조학회 2010 한국생산제조학회지 Vol.25 No.6
Recently, environment problems have effects on the electronic equipments. Security problems are presented. For security reasons, it is necessary to study electronic equipments. In this paper, we handle the Elasticity modulus on the polymer insulator by UV irradiation. The types of material are used in this experiment, is the EPDM (Ethylene Propylene Diene Monomer). For increasing the reliability, real material specimens are used. For this study, we used ESPI (Electronic speckle pattern interferometry), UTM (Universal thesting machine) device, Accelerated weathering tester. Through this measurement, we evaluated how much UV irradiation has effect on polymer insulator and how long does it take to change the polymer insulator. Also this paper will give a help in electronic industry and the method of measuring the insulator elasticity modulus of polymer could be utilized in life estimation and replacement time of the products of electronic equipment that is used in real industrial fields.
광학식 3차원 측정을 이용한 LCD 판넬의 프레스 금형 공정별 변형 측정
김경석(Kyeong-Suk Kim),홍성성(Sung-Sung Hong),김동수(Dong-Soo Kim),정덕운(Duk-woon Jung),김우진(Woo-Jin Kim),송재근(Jae-geun Song),장호섭(Ho-Seob Chang) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
LCD panel when molded into a press mold Depending on the type and purpose of the panels will pass several processes. At this point LCD panel inside the case of uneven load As a result, the shape of the product will be transformed. If the image on the LCD panel deformation Products, does not function as It is important to identify the degree of deformation is. Typical methods to measure is the shape Moire method in which the approach has drawbacks. LCD panel when molded into a press mold in the form of panels and goes through different processes depending on usage. At this time inside the LCD panel in the event of uneven loading of the resulting product is transformed shape.
레이저 스페클 전단간섭법을 이용한 압력용기 내부결함의 측정 가능한 결함 크기의 평가
김경석(Kyeong-Suk Kim),선상우(Sang-Woo Seon),최태호(Tae-Ho Choi),강찬근(Chan-Geun Kang),나만균(Man-Gyun Na),정현철(Hyun-Chul Jung) 한국비파괴검사학회 2014 한국비파괴검사학회지 Vol.34 No.2
최근 압력용기가 다양한 산업분야에서 사용되고 있다. 압력용기의 내부 또는 외부에 결함이 발생하면 대형 사고를 유발하게 된다. 압력용기의 외부에 발생하는 결함은 육안검사를 통해 어느 정도 해결이 가능하지만, 압력용기 내부에 발생하는 결함은 육안검사로는 측정하기 어렵다. 이러한 형태의 결함을 측정하기 위해서는 비파괴검사가 적합하다. 전단간섭법은 광계측을 이용한 비파괴검사법 중 하나이며, 비접촉식으로 전체 측정영역에 대해 실시간으로 한 번의 실험을 통해 결함을 측정할 수 있다는 장점을 지니고 있다. 본 논문에서는 레이저 스페클 전단간섭법을 이용하여 측정할 수 있는 압력용기의 내부에 존재하는 결함 크기를 평가하였다. ASTM A53 Gr.B 재질로 제작된 압력용기 시험편 내부에 인위적인 결함을 가공하고 공압을 이용하여 압력용기에 내압을 가하여 결함을 측정하였다. 실험을 통해 0.2 MPa의 압력차에서도 압력용기의 원래 두께의 25 %의 깊이로 발생한 결함까지는 측정 가능함을 확인하였다. Pressure vessels are used in various industrial fields. If a defect occurs on the inner or outer surface of a pressure vessel, it may cause a massive accident. A defect on the outer surface can be detected by visual inspection. However, a defect on the inner surface is generally impossible to detect with visual inspection. Nondestructive testing can be used to detect this type of defect. Laser speckle shearing interferometry is one nondestructive testing method that can optically detect a defect; its advantages include noncontact, full field, and real time inspection. This study evaluated the detectable size for an internal defect of a pressure vessel. The material of the pressure vessel was ASTM A53 Gr.B. The internal defect was detected when the pressure vessel was loaded by internal pressure controlled by a pneumatic system. The internal pressure was controlled from 0.2 MPa to 0.6 MPa in increments of 0.2 MPa. The results confirmed that an internal defect with a 25 % defect depth could be detected even at 0.2 MPa pressure variation.
반사형 디지털 홀로그래피를 이용한 Molybdenum 박막의 손상 측정
김경석(Kyeong-Suk Kim),정현일(Hyun-Il Jung),신주엽(Ju-Yeop Shin),마혜준(Hye-Joon Ma),권익환(Ik-Hwan Kwon),양승필(Seung-Pill Yang),홍정기(Chung-Ki Hong),정현철(Hyun-Chul Jung) 한국비파괴검사학회 2015 한국비파괴검사학회지 Vol.35 No.2
전자제품에 필수적으로 사용되는 전자회로의 제작 시, 반도체 위에 증착하는 박막의 산화를 방지하기 위하여 molybdenum을 증착한다. Molybdenum 박막 증착 시 표면의 particle 또는 dust의 존재는 밀착력 감소 및 성능 저하, 수명 단축, 안전도 저하를 유발한다. 본 논문에서는 particle의 유무에 따른 molybdenum 박막 증착부의 변화를 보기 위하여, 두 가지 glass substrate를 대상으로 손상 측정 실험을 하였다. Sputtering 증착 기법으로 molybdenum이 glass substrate에 직접 코팅이 되는 clean과 dirty 두 종류의 molybdenum 박막을 제작하고, 손상 측정을 위해 반사형 디지털 홀로그래피를 구성하였다. 반사형 디지털 홀로그래피는 간섭계의 구성이 손쉽고 다양한 배율렌즈를 적용하여 측정영역에 다양성을 줄 수 있으며, 측정시간이 타 기법에 비해 짧다는 장점을 가진다. 실험 결과로부터 반사형 디지털 홀로그래피가 박막의 손상 및 결함 측정에 유용한 기술임을 확인하였다. In the fabrication of electronic circuits used in electronic products, molybdenum thin films are deposited on semiconductors to prevent oxidation. During the deposition, the presence of a particle or dust at the interface between the thin film and substrate causes the decrease of adhesion, performance, and life cycle. In this study, a damage measurement targeting two kinds of glass substrate, with and without particles, was performed in order to measure the change in the molybdenum thin film deposition area in the presence of a particle. Clean and dirty molybdenum thin film specimens were fabricated and directly deposited on a substrate using the sputtering method, and a reflection-type digital holographic interferometer was configured for measuring the damage. Reflection-type digital holography has several advantages; e.g., the configuration of the interferometer is simple, the measurement range can be varied depending on the magnification of a microscopic lens, and the measuring time is short. The results confirm that reflection-type digital holography is useful for the measurement of the damage and defects of thin films.