그래핀을 이용한 전자패키징 기술 연구 동향

고용호,최경곤,김상우,유동열,방정환,김택수,Ko, Yong-Ho,Choi, Kyeonggon,Kim, Sang Woo,Yu, Dong-Yurl,Bang, Junghwan,Kim, Taek-Soo 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.2

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

사비르므졸리,Heung Soo Kim 대한금속·재료학회 2018 ELECTRONIC MATERIALS LETTERS Vol.14 No.4

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmiccontacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the nextgenerationpower electronics packaging. The interesting and unique characteristic of this packaging is the use of diamondas a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronauticalapplications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking thesemi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important toprotect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems areNi/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bondingtechnologies, including AuGe soldering, Ag–In Transient liquid Phase Bonding and silver nanoparticle sintering. Themetallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried outat room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiationand growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failuremechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density ofthese cracks depends on the imposed load and the involved metallization. These observations will help choose the metallizationthat is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so thatthey can be used as a constitutive component for high-temperature power electronics packaging.

간섭식 모아레를 이용한 전자 패키지의 실시간 신뢰성 모니터링 시스템

박진형(Jin-Hyoung Park),이순복(Soon-Bok Lee) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6

Like a diagnosis of human body, it is important to monitor the conditions of electronic package in use. Even if electronic package is well made, thermal cycles in use make the fatigue crack that makes the system failure eventually. If we know the crack length in the package in real-time, the great damage is prevented before the system failure. In this day, there are no simple methods for real-time monitoring electronic package in use. In this research, we propose the non-destructive method that detects the crack length in electronic package. When the crack occurs, thermal deformation on the chip side is changed. So, we can measure these deformations by using moire interferometry and find out the crack length. The monitoring method that is proposed is applied to the ACF type package specimens.

Core-Shell Nanowire Based Electrical Surface Fastener Used for Room-Temperature Electronic Packaging Bonding

Peng Wang,Yang Ju,Atsushi Hosoi 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.2

With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~24 N/cm2 and an electrical resistance of ~0.41 × 10−2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.

플립칩 패키지의 열소산 최적화 연구

박철균,이태호,이태경,정명영,Park, Chul Gyun,Lee, Tae Ho,Lee, Tae Kyoung,Jeong, Myung Yung 한국마이크로전자및패키징학회 2013 마이크로전자 및 패키징학회지 Vol.20 No.3

전자패키징 기술의 발전에 따라 패키지의 소형화는 집적화에 따른 열 소산 면적 감소로 인하여 패키지의 온도 상승을 초래한다. 온도 상승은 소자의 성능을 저해하여, 시스템 고장을 발생을 유발시키며 수명을 단축시킨다. 본 연구에서는 마이크로 패턴과 세미 임베디드 구조를 결합하여 열 소산을 극대화 시킬 수 있는 새로운 구조를 제안하여 열특성을 평가하였다. 제안 구조의 열특성 평가 결과, 기존 구조에 비하여 최대 온도는 $20^{\circ}C$낮았으며, 범프의 최대 응력은 20%이상 감소하여 제안 구조의 유효성을 확인하였다. According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.

시그널 기반 전자패키지 결함검출진단 기술과 인공지능의 응용

강태엽,김택수 한국마이크로전자및패키징학회 2023 마이크로전자 및 패키징학회지 Vol.30 No.1

With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques. 고성능 전자제품의 수요가 증가함에 따라 이를 구현하기 위한 고성능 반도체의 수요도 증가하고 있다. 그러나성능이 높아지고 운용환경이 다양해질수록 전자패키지의 신뢰성이 회로 전체의 성능과 신뢰성에 병목이 되고 있는 상황이다. 이에 전자패키지에 대한 결함검출 및 진단 기술이 주목받고 있는데, IEEE 이종집적화 로드맵에서는 신뢰성 물리및 인공지능 기술을 융합한 디지털트윈 전략을 제시하고 있다. 따라서 본 논문에서는 시그널 기반의 전자패키지 결함검출 및 진단 기술을 리뷰하고, 인공지능을 접목한 연구사례를 분석하고자 한다. 더불어 이러한 인공지능 응용 연구의 동향과 전망을 함께 제시한다.

Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

Zhenzhen Shan,Ke Lin,Anmin Hu,Ming Li 대한금속·재료학회 2022 ELECTRONIC MATERIALS LETTERS Vol.18 No.6

It is the first time that the mitigation and mechanism of tin whisker on micro-bumps by different types of underfills are investigated under high temperature and humidity (55 ℃/88% RH) storage. Hard epoxy, soft silicone and polyurethane are selected as underfills to spin-coat the 10 μm-diameter and 20 μm-pitch Cu/Ni/SnAg micro-bumps. After six-month storage, underfills exhibite a good mitigation effect despite the surface decomposition, delamination, cracks and voids in varying degrees. Compared with the micro-bumps without underfill, the probability of whisker or hillock and oxidation or corrosion in micro-bumps is reduced by up to 66% and 96%, respectively. Based on the statistics and characterization results, the mitigation mechanism of tin whisker by underfills is proposed. The diameter and critical length of tin whisker are discussed as well to estimate its buckle or penetrate growth. Besides, several underfills failures are summarized. The findings are of great significance to the study of tin whisker mitigation on micro-bumps and provide insights into the reliability of advanced packaging.

양면 열박리 테이프 기반 임시 접합 공정을 이용한 대면적 웨이퍼 레벨 고출력 전자패키지

황용식 ( Yong-sik Hwang ),강일석 ( Il-suk Kang ),이가원 ( Ga-won Lee ) 한국센서학회 2022 센서학회지 Vol.31 No.1

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8- in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

Estimating Interfacial Interaction Energy of Cu-Epoxy Resin from Molecular Dynamics Simulation

Dong rong Xin,Qiang Han 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.3

Interfacial delamination is one of the typical failure modes in electronic packages. To obtain good reliability of electronic packages, it is important to study the interface properties. In this study, molecular dynamics simulation is conducted to investigate the interfacial interaction energy of Cu-epoxy resin, which is widely used in electronic packages, and the effects of temperature, moisture, crosslink conversion and oxidation degree. The results show that the interaction energy of Cu-epoxy resin is almost independent of the cross-link conversion of the epoxy resin, whereas it is weakened by increasing temperature, moisture and oxidation. Meanwhile, the mechanism of interfacial energy variation is revealed on a molecular scale, which is useful for understanding the interfacial interaction and interfacial delamination.

전자제품 완충포장재의 형상에 따른 최적설계 연구

신태명(Tae-Myung Shin),김수범(Su-Beom Kim) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11

Electronic products are seriously damaged due to external impact of distribution process. Thus, electronic products are necessary to cushioning package. Cushioning packages are often used by EPS(expanded Polystyrene). EPS(Expanded Polystyrene) are used for cushioning package of electronic products. In this study, Design parameters of actual used cushioning package of LCD monitor are selected and performed to investigate the dynamic behavior by finite element analysis. ABAQUS/Explicit is used by the finite element analysis. As a result, the solution are compared by using design of experiment, and then optimal design parameters are derived.