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Back, Seunghyun,Kang, Bongchul Elsevier 2018 Optics and lasers in engineering Vol.101 No.-
<P><B>Abstract</B></P> <P>Fabricating copper electrodes on heat-sensitive polymer films in air is highly challenging owing to the need of expensive copper nanoparticles, rapid oxidation of precursor during sintering, and limitation of sintering temperature to prevent the thermal damage of the polymer film. A laser-induced hybrid process of reductive sintering and adhesive transfer is demonstrated to cost-effectively fabricate copper electrode on a polyethylene film with a thermal resistance below 100 °C. A laser-induced reductive sintering process directly fabricates a high-conductive copper electrode onto a glass donor from copper oxide nanoparticle solution via photo-thermochemical reduction and agglomeration of copper oxide nanoparticles. The sintered copper patterns were transferred in parallel to a heat-sensitive polyethylene film through self-selective surface adhesion of the film, which was generated by the selective laser absorption of the copper pattern. The method reported here could become one of the most important manufacturing technologies for fabricating low-cost wearable and disposable electronics.</P> <P><B>Highlights</B></P> <P> <UL> <LI> Cost-effective fabrication of high-conductive copper electrode on heat-sensitive polymer film. </LI> <LI> Direct fabrication of copper electrode via laser-induced reductive sintering of low-cost copper oxide nanoparticle. </LI> <LI> Laser-induced parallel transfer of sintered copper electrode to heat-sensitive PET film. </LI> <LI> Fabrication of high-conductive copper electrode on low-cost PET films from air-stable copper oxide nanoparticles. </LI> <LI> Exploitable in the manufacturing process of low-cost wearable and disposable electronic devices. </LI> </UL> </P>
Back, Seunghyun,Kim, Seongbeom,Kwon, Seung-Gab,Park, Jong Eun,Park, Song Yi,Kim, Jin Young,Kang, Bongchul American Chemical Society 2018 ACS APPLIED MATERIALS & INTERFACES Vol.10 No.42
<P>We report a novel one-step bottom-up fabrication method for multiscale-structured black Si, which is characterized by randomly distributed microscale Si layers covered with sub-100 nm protrusions with submicron boundary grooves. The unique multiscale structure, suggested as a “nanocanyon,” effectively minimizes light reflection over a broad spectrum by diversifying the scattering routes from the nanotextured surface to the wide distributed boundary micronanoscale grooves. This structure was achieved by hydrophobic clustering and local aggregation of instantaneously melted Si nanocrystals on a glass substrate under laser irradiation. This method can replace the complicated conventional silicon processes, such as patterning for selective Si formation, texturing for improved absorption, and doping for modifying the electrical properties, because the proposed method obviates the need for photolithography, chemical etching, vacuum processes, and expensive wafers. Finally, black Si photosensor arrays were successfully demonstrated by a low-cost solution process and a laser growth sintering technique for microchannel fabrication. The results show the great potential of the proposed fabrication method for low-cost and sustainable production of highly sensitive optoelectronics and as an alternative to conventional wafer-based photosensor manufacturing techniques.</P> [FIG OMISSION]</BR>
실리콘 레이저 소결에서 은 나노 입자의 도핑 효과에 관한 연구
백승현(Seunghyun Back),권승갑(Seung-Gab Kwon),Liyana Hazawani Biniti Zamri,강인구(Ingu Kang),강봉철(Bongchul Kang) 한국생산제조학회 2019 한국생산제조학회지 Vol.28 No.1
Silicon is used as an essential material in the electronic and energy industries owing to its high accessibility and inherent semiconducting properties. Typically, silicon devices are produced by top-down chemical etchings, such as anisotropic etching and reactive ion etching, to make micropatterns and surface textures. In addition, doping using thermal diffusion or ion implantation is also required to optimize electrical characteristics. We propose a one-step method for fabricating multi-scale silicon layer based on the concurrent interaction of doping of silver nanoparticles during laser-induced sintering of silicon nanocrystals. The silver-doped silicon patterns were characterized by a uniform distribution and the concentration of dopants was easily adjustable by controlling the relative amount of silver nanoparticles. We expect that this method will contribute to fabricating multi-scale silicon semiconductors without using complicated chemical and vacuum processes.