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경영정보시스템 구축을 위한 생산자동화시스템의 접속에 관한 연구
허성관,장석진,권택진,임승환 大邱大學校 科學技術硏究所 1999 科學技術硏究 Vol.6 No.2
This paper provided to solve the interface between CIM and MIS database system design procedure and their solutions. There are many changes to processing the management data using computer systems, but a few studies are developed to integrated processing the huge information data. According to this situation, distributed data management becomes managed by integrated information processing system. And the manufacturing information has been developed separately with their own work flow and characteristics. It makes difficult to rebuild integrated control. Therefore this study invokes standardization of all data transaction and management there procedure.
Testosterone에 의한 승홍의 신독성 유발에 의한 연구
김회영,허근,김석환,최종원 東亞大學校 附設 生活科學硏究所 1993 생활과학연구 논문집 Vol.1 No.-
Mercuric chloride, inorganic compound, is one of the most important drugs that has been used in the field of argriculture, antisyphilitica and anticeptics, but it is not used clinically at present. We have studied the effect of testosterone on the mercuric chlorideinduced nephrotoxicity. Renal lipid peroxide concentration of male rat treated with mercuric chloride was significantly increased in comparison with that of the female rat, it showed similar effects on testosterone pretreatment. Changes in renal catalase and glutathione peroxidase activities were not siginificantly different in testosterone-treated groups. But, renal xanthine oxidase and aldehyde oxidase activities of testrosterone-treated group given mercuric chloride significantly increased in comparison with that of the testosterone-treated alone. Animals treated with testosterone prior to mercuric chloride showed more severe damage on histological observations than those treated with testosterone only. Consequently, we suggest that the mercuric chloride-induced nephrotoxicity might be renal lipid peroxide generating enzyme system by testosterone.
마늘成分이 肝 Glutathione S-Transferase 및 Glutathione peroxidase 活性에 미치는 影響
朴鍾珉,李相日,金善業,許瑾,金碩煥,徐赫珪 嶺南大學校 環境問題硏究所 1985 環境硏究 Vol.5 No.2
Garlic (Allium sativum L.) is a widely distributed plant used in all parts of the world not only as a spice but also as a popular remedy for several thousand years Recent studies have shown that garlic components may regulate the many metabolism in liver. Therefore, the present work was undertaken to study the effect of garlicjuice, allicin fraction and heat-treated allicin fraction on the hepatic glutathione s-transferase and glutathione peroxidase which protect against toxic compound and lipid peroxide in liver. The results obtained were summarized as follows. By the treatment of garlic juice, glutathione s-transferase and glutathione peroxidase activity was increased in hepatic cytosolic fraction compare with control group. The enzyme activtiy is more increased by treatment with boiled garlic juice compared with fresh garlic juice in rats. The effect of allicin fraction and heat-treated allicin fraction on the hepatic glutathione s-transferase was observed that these components inhibited the enzyme activity in vitro, whereas the enzyme activity was strongly inhibited heat-treated allicin fraction than allicin fraction. These observation led us to conclude that the garlic components which are a stable substance in heat may regulate the hepatic glutathione s-transferase and glutathione peroxidase activity.
Nucleation and Growth Behaviors of Pd Catalyst and Electroless Ni Deposition on Cu (111) Surface
Huh, Seok-Hwan,Choi, Sung-Ho,Shin, An-Seob,Ham, Suk-Jin,Moon, Seongjae,Lee, Hyo-Jong The Electrochemical Society 2016 Journal of the Electrochemical Society Vol.163 No.2
<P>The electroless nickel plating process was used for protecting the copper pad of printed circuit boards from oxidation, which needs Pd catalytic treatment on the copper surface before Ni growth. The quantity of Pd deposition had a linear relationship with the activation time, while the Ni growth on the Pd-activated Cu films was accelerated with the deposition time by auto-catalytic reaction. It was confirmed that both Pd and Ni were grown coherently on the Cu (111) plane based on the high-resolution TEM measurement. The in-plane lattice misfits of Pd (111) and Ni (111) to Cu (111) are 7.6% (compressive) and 2.5% (tensile), respectively. The Pd grew in a dot-like rather than a two-dimensional form due to the large lattice mismatch. In addition, the lattice mismatch of Ni (111) to Pd (111) is 9.4% (tensile), and the larger lattice misfit seems to make it difficult for the Ni to nucleate on the Pd nuclei. It can be deduced that the Pd works simply as an electron supplier by oxidizing a reducing agent and the Ni reduction occurs preferably on the Cu surface by an electron from the Pd. (C) 2015 The Electrochemical Society.</P>
Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method
Huh, Seok-Hwan,Kim, Kang-Dong,Kim, Keun-Soo Emerald Group Publishing Limited 2014 Circuit world Vol.40 No.2
<B>Purpose</B> - The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 90° peel test. <B>Design/methodology/approach</B> - In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system. <B>Findings</B> - The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910?cm<SUP>-1</SUP>) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength. <B>Research limitations/implications</B> - It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro- and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials. <B>Originality/value</B> - From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.
Biased HAST 시험에서의 인쇄회로기판 수명 예측
허석환(Seok-Hwan Huh) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.2
By the trends of electronic package to be high performance and high integrative, build-up printed circuit boards (PCBs) are required to be highly integrated circuits and highly reliable circuits. PCBs are subjected to varying temperature and moisture exposures throughout whole their lives. This paper reports on the lifetime predictions of printed circuit boards under biased highly accelerated stress testing (HAST). In the failure analysis, it is found that porous CuxO colloids and Cu dendrites were formed at anode (+) trace and at cathode (-) trace, respectively. It is clear that the failure mechanism of the test legs is Cu corrosion, Cu ionmigration, and Cu metallization between a couple of test traces. The median lives of the test legs were calculated by the log-normal distribution. Based on the failure mechanism, the lifetime model for temperature and humidity stress is assumed to be a modified Peck model. We obtained the lifetime’s equation using the time to failure of the biased HAST, the median lifetime in the user condition was calculated as 19,321 years and 95% confidence interval (42876.9, 8706.7).
반도체 배선용 구리 도금층의 미세조직 및 전기비저항 고찰
허석환 ( Seok Hwan Huh ),전형진 ( Hyoung Jin Jeon ),추현수 ( Hyun Soo Chu ),송영석 ( Young Seok Song ),이성근 ( Sung Keun Lee ),이효종 ( Hyo Jong Lee ),이의형 ( Ui Hyoung Lee ) 대한금속재료학회(구 대한금속학회) 2014 대한금속·재료학회지 Vol.52 No.11
Copper electrodeposits annealed at 80 ℃ were investigated by electrical resistance measurement, X-ray diffraction and electron backscattered diffraction analyses. The decrease of electrical resistivity had a linear relationship with the re-crystallized area. Interestingly, the texture coefficient of (200) orientation increased as the re-crystallization occurred. Such appearance of (200) texture during annealing seemed to be related to the residual strain in the copper electrodeposits. It is possible to evaluate the progress of grain growth by measuring the electrical resistivity or texture coefficient in copper electrodeposits. (Received July 23, 2013)
A Study on the Differential Gearing Device with the Faculty of a Limited Slip Differential
Huh, Yong,Kim, Hyung-Ick,Shin, In-Hwan,Koo, Jae-Mean,Seok, Chang-Sung 한국정밀공학회 2009 International Journal of Precision Engineering and Vol.10 No.3
The limited slip differential (LSD) is a device which enables the driving force to be transmitted from one slipping wheel to another by temporarily restraining the differential function when unwanted slipping occurs on muddy or icy roads. Many types of LSDs were developed such as the mechanical lock, disk clutch, viscous coupling, Torsen and multiple clutch type. This study designed a new type of differential gearing device with the faculty of a limited slip differential, and then evaluated its performance.