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Mani Dineshkumar,Vu Minh Canh,Nguyen Vo Anh Thao,정태형,김준범,김성룡 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.2
Fabrication of polymer composites with high thermal conductivity and electrical insulation are necessity in electronic devices to dissipate the excessive heat. We report thermally conducting yet electrically insulating 3D structure of graphene fluoride (GF) based epoxy composites. GF was assembled on the cell walls of polyurethane foam (PUF) by dip-coating method. The PUF@GF was compressed and infiltrated with epoxy resin. Notably, the PUF@GF/epoxy composites exhibited maximum thermal conductivity of 9.68 W/mK at 8.04 vol% of GF loading which exhibits an enhancement of 4994% compared to the neat epoxy. The enhancement in thermal conductivity is owing to the well-connected 3D network of GF in the epoxy matrix. Moreover, the PUF@GF/epoxy composites show good electrical insulation property (10<SUP>-9</SUP> S/m). This strategy exhibits a cost-effective way to fabricate thermoconductive composites for thermal management in electronic devices. Acknowledgment: The research was supported by a grant from the Academic Research Program of Korea National University of Transportation in 2021.
Enhanced Thermal Conductivity of Nanocomposites with Vertically Aligned Silicon Carbide Sheets
김성룡,Vu Minh Canh,정태형,김준범,Dineshkumar Mani 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.1
Thermally conductive epoxy composites have been prepared with three-dimensional (3D)-structured SiC sheets. Graphene oxide was finally transformed into SiC by a template-assisted chemical vapor deposition. Epoxy resin was infiltrated into the empty spaces of the SiC scaffold and the nanocomposites shows anisotropic thermal property with ultrahigh through-plane conductivity at a less than 5 vol% of SiC sheet content. A thermal percolation theory was proposed to explain the experimental results of SiC based nanocomposites. The chemically bonded SiC nanoparticles at high temperature is a main factor to provide the highly thermal conductive composites.