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        Study on Oxidant in Chemical Mechanical Polishing of Copper

        Xu Rui,Wang Yongsheng,Wang Yipu,Liu Haixu,Su Jianxiu 한국전기전자재료학회 2020 Transactions on Electrical and Electronic Material Vol.21 No.6

        In this paper, the polishing experiment of copper was carried out. According to the experimental data, when FeCl 3 was selected as oxidant, the material removal rate increases gradually with the increase of oxidant concentration. When other conditions remain unchanged, the material removal rate with larger abrasives was higher than that of smaller abrasives, and the material removal rate of pressure 3 psi was higher than that of pressure 2 psi, and the surface roughness became smaller and smaller. When the abrasive size was 1 μm, oxidant concentration was 5 g/L and the pressure was 3 psi, the material removal rate reaches 206.9 nm/min and the surface roughness reached 8 nm. When the type of oxidant was chosen as the variable, the material removal rate of the mixture of FeCl 3 and H 2 O 2 was the highest, the maximum removal rate was 105.45 nm/min when the abrasive size was 1 μm and polishing speed was 80 r/min. The surface roughness was the smallest when FeCl 3 was used as oxidant and Ra reaches the smallest 5 nm under the conditions of the abrasive size was 1 μm and polishing speed 80 r/min. The results can be used as a reference for further research the ingredients of polishing slurry in the chemical mechanical polishing of copper.

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        A Novel Technique for Dressing Fixed Abrasive Lapping Pad with Abrasive Water Jet

        Zhankui Wang,Yakun Yang,Zhao Zhang,Minghua Pang,Mingchao Liang,Lijie Ma,Jianxiu Su 한국정밀공학회 2023 International Journal of Precision Engineering and Vol.10 No.6

        The dressing method and dressing quality of the fixed abrasive lapping pad significantly impact the processing efficiency and surface quality of the workpiece material. Aiming at the problems of poor dressing effect and high damage degree of the lapping pad in the existing fixed abrasive dressing technology, a new technology using abrasive water jet for dressing is proposed. The self-developed abrasive water jet system was used to conduct a dressing test on a fixed abrasive lapping pad with a copper content of 30%. The influence of jet pressure, nozzle target distance, abrasive concentration and injection angle on the dressing effect were discussed, and the influence mechanism was analyzed by discrete element simulation. The results show that the dressing effect of the abrasive water jet is good. The dressing quality first increases and then decreases with the increase of jet pressure, nozzle target distance and injection angle, and increases with the increase of abrasive concentration. The influence mechanism of each parameter is closely related to the residual height of the lapping pad surface after dressing. The higher the residual height, the rougher the lapping pad surface, and the better the dressing effect of the lapping pad.

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