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Jong-Sung Lee,Young-Joo Lee,Jaegeun Seol,Young-Chang Joo,Byoung-Joon Kim 대한금속·재료학회 2024 ELECTRONIC MATERIALS LETTERS Vol.20 No.2
The distinguishing feature of a fl exible electronic device is that it maintains its function even when the shape changes repeatedly. As the degree of integration of fl exible devices increases, revealing failure mechanisms and extending the lifetime ofthe fl exible devices are getting more diffi cult. One of the potential damage zones is the interface of heterogeneous materialcomponents, where strain can be localized due to the mismatch of mechanical properties. In this study, we investigate themechanically reliable interconnect design of the fl exible printed circuit board (FPCB) system in which the packaging chipis integrated. When the FPCB was bent, folding occurred at the edge of the packaging chip due to the high bending rigiditycompared with the plastic substrate and resulted in high strain concentration. By introducing interconnect architecture thatbypassed the strain concentration area around the packaging chip, mechanical damage of the interconnects was successfullyreduced. Through fi nite element simulation, the strain applied to the interconnect crossing the strain-concentrated regionwas predicted to be 2 times larger than that bypassing the strain-concentrated region, from 8.32 to 4.64%. In addition, thestrain gap of these two interconnects could be increased as the Young’s modulus mismatch between the packaging chip andthe substrate increased. This study is expected to improve the design guidelines to mechanically reliable interconnects inhighly integrated fl exible electronics.