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Sputter-Redeposition Method for the Fabrication of Automatically Sealed Micro/Nanochannel using FIBs
김흥배,Gerhard Hobler,Andreas Steiger,Alois Lugstein,Emmerich Bertagnolli,Elmar Platzgummer,Hans Loeschner 한국정밀공학회 2011 International Journal of Precision Engineering and Vol. No.
In this article, we report a new method for micro/nano fluidic channel fabrication by focused ion beams (FIB) utilizing the redeposition flux, or what we will refer to in this paper as SRM (sputter-redeposition method). Sputtered particles are byproduct of sputter process whereas it limits the focused ion beam (FIB) process. However, the sputtered particles can be useful in the fabrication of certain shapes of structures. The objective of this article is the demonstration of active utilization of the sputtered particles. A micro/nano-fluidic channel fabrication is demonstrated for the topic. As an application, in the fluidic channel fabrication we demonstrate two-step process; trench formation and automatic sealing in the micro-/nanometer range. This method channels from hundreds to tens of nanometers wide can be fabricated by using silicon as a channel substrate. The shape and dimensions of the channel cross-section are readily changed by varying the process parameters. This control of redeposition technique is advantageous because of the accuracy and simplicity of the process compare to other fluidic channel fabrication process.
Sputter-Redeposition Method for the Fabrication of Automatically Sealed Micro/Nanochannel using FIBs
Kim, Heung-Bae,Hobler, Gerhard,Steiger, Andreas,Lugstein, Alois,Bertagnolli, Emmerich,Platzgummer, Elmar,Loeschner, Hans 한국정밀공학회 2011 International Journal of Precision Engineering and Vol.12 No.5
In this article. we report a new method for micro/nano fluidic channel fabrication by focused ion beams (FIB) utilizing the redeposition flux. or what we will refer to in this paper as SRM (sputter-redeposition method). Sputtered particles are byproduct of sputter process whereas it limits the focused ion beam (FIB) process. However, the sputtered particles can be useful in the fabrication of certain shapes of structures. The objective of this article is the demonstration of active utilization of the sputtered particles. A micro/nano-fluidic channel fabrication is demonstrated for the topic. As an application, in the fluidic channel fabrication we demonstrate two-step process; trench formation and automatic sealing in the micro-/nanometer range. This method channels from hundreds to tens of nanometers wide can be fabricated by using silicon as a channel substrate. The shape and dimensions of the channel cross-section are readily changed by varying the process parameters. This control of redeposition technique is advantageous because of the accuracy and simplicity of the process compare to other fluidic channel fabrication process.
“AMADEUS” Software for Ion Beam Nano Patterning and Characteristics of Nano Fabrication
김흥배(H. B. Kim),G. Hobler,A. Lugstein,E. Bertagonolli 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
The shrinking critical dimensions of modern technology place a heavy requirement on optimizing feature shapes at the micro- and nano scale. In addition, the use of ion beams in the nano-scale world is greatly increased by technology development. Especially, Focused Ion Beam (FIB) has a great potential to fabricate the device in nano-scale. Nevertheless, FIB has several limitations, surface swelling in low ion dose regime, precipitation of incident ions, and the re-deposition effect due to the sputtered atoms. In recent years, many approaches and research results show that the re-deposition effect is the most outstanding effect to overcome or reduce in fabrication of micro and nano devices. A 2D string based simulation software AMADEUS-2D (UAUdvanced UMUodeling UaUnd UDUesign UEUnvironment for USUputter Processes) for ion milling and FIB direct fabrication has been developed. It is capable of simulating ion beam sputtering and re-deposition. In this paper, the 2D FIB simulation is demonstrated and the characteristics of ion beam induced direct fabrication is analyzed according to various parameters. Several examples, single pixel, multi scan box region, and re-deposited sidewall formation, are given.
Analysis of Ion Beam-Solid Interactions for Nano Fabrication
김흥배(H. B. Kim),G. Hobler 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
Ion beam processing is one of the key technologies to realize maskless and resistless sub 50nm nano fabrication. Unwanted effects, however, may occur since an energetic ion can interact with a target surface in various ways. Depending on the ion energy, the interaction can be swelling, deposition, sputtering, re-deposition, implantation, damage, backscattering and nuclear reaction. Sputtering is the fundamental mechanism in ion beam induced direct patterning. Re-deposition and backscattering are unwanted mechanisms to avoid. Therefore understanding of ion beam-solid interaction should be advanced for further ion beam related research. In this paper we simulate some important interaction mechanisms between energetic incident ions and solid surfaces and the results are compared with experimental data. The simulation results are agreed well with experimental data.