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Flexible air breathable electroluminescent device based on electrospinning process
Ce Li,Shaoqiang Gu,Tao Ma,Dongchan Li 대한금속·재료학회 2022 ELECTRONIC MATERIALS LETTERS Vol.18 No.6
Alternative current electroluminescent device with excellent air permeability were fabricated by a facile electrospinningmethod, and the optimal fabrication conditions of the device substrate and light-emitting layer, such as voltage, acceptancedistance, concentration, and propulsion rate, were determined. The microscopic morphology, luminance and air permeabilityof the samples were explored and analyzed. The characterization results show that the flexible alternative current electroluminescentdevice fabricated by electrospinning method exhibits excellent mechanical properties and high air permeability. The device can reach 55.74 cd/m2 at a voltage of 130 V and a frequency of 3 kHz, and the air permeability can reach 5.81 g/(h·m2). It is discussed that its excellent breathability is attributed to the overall microns fabric structure. On the basis ofthese results, we believe our electrospinningac process will accelerate development of more comfortable electroluminescentdevices with the flexibility required for real-world applications.
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이추실(QiuShi Li),김민철(MinCheol Kim),정동찬(DongChan Jung),손요헌(YoHun Son),전만수(ManSoo Joun) Korean Society for Precision Engineering 2011 한국정밀공학회지 Vol.28 No.3
In this paper, effects of major design parameters of cold forging dies on die mechanics are quantitatively investigated with emphasis on shrink fit using a thermoelastic finite element method. A ball-stud cold forging process found in a cold forging company is selected as a test process and the effects of die insert material, magnitude of shrink fit, dimension of shrink ring, number of shrink rings, partition of die insert and clamping force on effective stress and circumferential stress are analyzed. It has shown that the number of shrink rings, magnitude of shrink fit, and Young’s modulus of die insert material have strong influence on compressive circumferential stress in die insert but that the influence of the other design parameters is relatively weak.
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