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100X110μm² micro mirror array의 제작과 실험
지창현,정석환,신종우,김용권,최범규,안세진 경북대학교 센서기술연구소 1995 센서技術學術大會論文集 Vol.6 No.1
A 100 x110μm^(2) aluminum micro structure is fabricated using thick photoresist as sacrificial layer and mold for nickel electroplating. The micro structure is composed of aluminum plate, hinge, nickel support post, and address electrode. The aluminum plate is overhung about 10 μm above the silicon substrate supported by two nickel posts. The hinge connects the aluminum plate and the support post and works as a torsional spring. We used thick PR as 10 μm thick sacrificial layer and nickel electroplating mold and electroplated nickel for 10 μm high post. The aluminum plate is actuated by electrostatic force between the aluminum plate and the address electrode. The aluminum micro structure is finally released by reactive ion etching (RIE) using O_(2). The micro mirror is actuated at 35V.