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박채민 ( Chae Min Park ),이의형 ( Ui Hyoung Lee ),이효종 ( Hyo Jong Lee ) 대한금속재료학회(구 대한금속학회) 2016 대한금속·재료학회지 Vol.54 No.6
Copper was electroplated using plating baths containing various concentrations of Janus Green B (JGB, C30H31ClN6) from 0 to 1 mM. The electrical resistance, microstructure and impurity concentration were investigated by using four point probe, electron backscattered diffraction, and glow discharge spectroscopy analyses, respectively. The initial sheet resistance of the Cu films was increased by increasing the JGB concentration, and the impurity concentrations of C, H and N also linearly increased. At 0.2 mM of JGB, while the sheet resistance decreased by 7% for the initial resistance, crystal growth did not occur. The initial decrease in electrical resistance was due to the redistribution of impurities, and grain boundary migration was inhibited by solute dragging. As a result, we were able to retard the recrystallization of Cu electrodeposits using the impurities from the JGB additive. (Received April 4, 2016)
반도체 배선용 구리 도금층의 미세조직 및 전기비저항 고찰
허석환 ( Seok Hwan Huh ),전형진 ( Hyoung Jin Jeon ),추현수 ( Hyun Soo Chu ),송영석 ( Young Seok Song ),이성근 ( Sung Keun Lee ),이효종 ( Hyo Jong Lee ),이의형 ( Ui Hyoung Lee ) 대한금속재료학회(구 대한금속학회) 2014 대한금속·재료학회지 Vol.52 No.11
Copper electrodeposits annealed at 80 ℃ were investigated by electrical resistance measurement, X-ray diffraction and electron backscattered diffraction analyses. The decrease of electrical resistivity had a linear relationship with the re-crystallized area. Interestingly, the texture coefficient of (200) orientation increased as the re-crystallization occurred. Such appearance of (200) texture during annealing seemed to be related to the residual strain in the copper electrodeposits. It is possible to evaluate the progress of grain growth by measuring the electrical resistivity or texture coefficient in copper electrodeposits. (Received July 23, 2013)
Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링
김상혁 ( Sang Hyuk Kim ),신한균 ( Han Kyun Shin ),박채민 ( Chae Min Park ),김동욱 ( Dong Uk Kim ),차필령 ( Pil Ryung Cha ),이의형 ( Ui Hyoung Lee ),이효종 ( Hyo Jong Lee ) 대한금속재료학회(구 대한금속학회) 2015 대한금속·재료학회지 Vol.53 No.7
A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model.