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문전해 Ni-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향
오이식(I. S. Oh),이태희(T. H. Lee) 한국동력기계공학회 2005 한국동력기계공학회 학술대회 논문집 Vol.- No.-
The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing CuSo₄ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than 90℃ and under 70℃. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br Value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below 200℃), and were confirmed to have adequate bath stability for practical use.