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브리지 및 원형 금 박막의 기계적 물성 및 계면파괴인성치 측정
최우성(W.S. Choi),최승태(S.T. Choi),손상욱(S.U. Son),이승섭(S.S. Lee),양세영(S.Y. Yang),엄윤용(Y.Y. Earmme) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
In order to measure the mechanical properties of gold films on Si substrate, two types of specimens, i.e., bridged films and circular membranes, are manufactured. Using the wedge tip, the bridged films are indented so that the bridged gold films are pushed off, which is called as V-peel test. The load-deflection curves obtained by the V-peel tests are analyzed with the concept of geometrically nonlinear beam by using the minimum potential energy theory together with Ritz method. Young’s modulus and residual stress of the bridged gold films are obtained. Blister test is also conducted to measure the Young’s modulus and residual stress of the circular membrane specimens, of which deformation is measured by Twyman-green interferometer. By gradually increasing the applied pressure in the blister test, the interfacial fracture toughness between the gold film and Si substrate is measured.