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CMP Pad 표면 변화를 통한 초기 Polishing 특성 향상
김동우(Dongwoo Kim),Kathleen McHugh,안봉수(Bongsoo Ahn),김태성(Taesung Kim) 한국트라이볼로지학회 2010 한국트라이볼로지학회 학술대회 Vol.2010 No.6
In this work, we know that the Roughness on a CMP pad can present the status of a CMP Pad. If we manage a roughness of CMP pad, we can get a good CMP performance at an initial Pad life time. As a result of this work, we can get new generation Pad, called a Pre-Conditioned Pad. Based on experimental results, it is revealed that it can reduce a back up time of a CMP tool after changing its consumables. Because, it can improve the removal rate & defectivity at an initial pad life time.