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Development of point-of-use filter evaluation method using chemical mechanical planarization slurry
장선재,아툴 쿨르카르니,김형우,김태성,Jang, Sunjae,Kulkarni, Atul,Kim, Hyeong-U,Kim, Taesung Korean Association for Particle and Aerosol Resear 2016 Particle and Aerosol Research Vol.12 No.4
During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.
슬러리 공급 시스템을 이용한 화학적 기계적 연마 공정에서의POU 필터의 성능 평가
장선재,김호중,진홍이,남미연,아툴 쿨르카르니,김태성 한국입자에어로졸학회 2013 Particle and Aerosol Research Vol.9 No.4
The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process forplanarization of various materials and structures. Point‐of‐use (POU) filters are used in most of the CMP processes inorder to reduce the unwanted micro‐scratches which may result in defects. The performance of the POU filter isdepends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluatePOU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter testsystem to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filterwith retention size of 0.2 ㎛. Two POU filters of different make are evaluated for FE. We observed that both POUfilters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidalsilica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way