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방정환,이세형,신의선,김정한,이창우,Bang, Jung-Hwan,Lee, Se-Hyung,Shin, Yue-Seon,Kim, Jeong-Han,Lee, Chang-Woo 대한용접접합학회 2009 대한용접·접합학회지 Vol.27 No.1
Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.