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백병만(Byoungman Paik),이제훈(Jaehoon Lee),신동식(Dongsig Shin),이건상(Kunsang Lee) 한국생산제조학회 2012 한국생산제조학회지 Vol.21 No.1
The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.
나노초 및 피코초 레이저를 이용한 FPCB의 절단특성 분석
신동식(Dongsig Shin),이제훈(Jaehoon Lee),손현기(Hyonkee Sohn),백병만(Byoungman Paik) 한국레이저가공학회 2008 한국레이저가공학회지 Vol.11 No.4
Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PL and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed. low repetition rate and high peak power are required for precision machining.