http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
곽병길,박영민,국성준,Kwak, Byung-Kil,Park, Young-Min,Kook, Sung-June 한국반도체디스플레이기술학회 2007 반도체디스플레이기술학회지 Vol.6 No.1
Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.
곽병길(Byung-Kil Kwak),김창환(Changl-Hwan Kim),최병주(Byung-Ju Choi),김규호(Kyu-Ho Kim),이상봉(Sang-Bong Rhee) 한국조명·전기설비학회 2014 조명·전기설비학회논문지 Vol.28 No.11
In electrolysis smelting plants that using high DC current, the bus bar is most important facility for delivering the high current. The copper made bus bar is widely used for various advantages as good electrical and thermal conductivity, resonable malleability, ductility, and not rust easily. However, when high current in copper bus bar, temperature rises and maximum allowable current capacity is restricted by temperature of bus bar. In this paper, we investigated temperature variation of copper bus bar by putting cooling water channel imposed to bus bar construction. For the validity, various simulations were carried out.