http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Investigation on mirror surface grinding characteristics of SiC materials
Hiroshi Kasuga,Hitohsi Ohmori,Taketoshi Mishima,Yutaka Watanabe,Weimin Linc 한양대학교 세라믹연구소 2009 Journal of Ceramic Processing Research Vol.10 No.3
SiC materials such as sintered SiC, CVD-SiC, and monocrystalline SiC are hard-to-difficult to grind, and they are expected to be applied for optical elements, structural components, dies and molds, and semiconductors. The authors investigated the mirror surface grinding characteristics of these SiC materials. A comparison on mirror surface grinding characteristics between polycrystalline SiC and monocrystalline SiC has been conducted. Metal-bonded diamond grinding wheels and a rotary grinding method have been applied under a variety of grinding conditions. As a result, very high quality of mirror surfaces has been successfully achieved on both materials using high mesh sized grinding wheels. SiC materials such as sintered SiC, CVD-SiC, and monocrystalline SiC are hard-to-difficult to grind, and they are expected to be applied for optical elements, structural components, dies and molds, and semiconductors. The authors investigated the mirror surface grinding characteristics of these SiC materials. A comparison on mirror surface grinding characteristics between polycrystalline SiC and monocrystalline SiC has been conducted. Metal-bonded diamond grinding wheels and a rotary grinding method have been applied under a variety of grinding conditions. As a result, very high quality of mirror surfaces has been successfully achieved on both materials using high mesh sized grinding wheels.