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Stress grading in integrated power modules
C. Duchesne,M. Mermet-Guyennet,E. Dutarde,T.Lebey,S. Dagdag 전력전자학회 2007 ICPE(ISPE)논문집 Vol.- No.-
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.