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Rui-cheng Feng,Yong-nian Qi,Zong-xiao Zhu,Wen-yuan Song,Hai-yan Li,Mao-mao Wang,Zhi-yuan Rui,Feng-shou Gu 한국정밀공학회 2020 International Journal of Precision Engineering and Vol.21 No.4
Molecular dynamics, an eff ective method to gain an insight into nanometric behaviour of materials, was employed to studythe nano-cutting behaviour of single crystal Ni 3 Al in nanometric scale. In this paper, comparisons were made for compressive/tensile stress, subsurface damage and surface roughness with three rake angles of a diamond tool. Subsurface damage waspartitioned by region and studied with work hardening in detail. A model for precise characterization of surface roughnesswas established with consideration of local surface fl uctuation. Simulation results showed that the chip thickness increasedas rake angle changed from negative to positive, and the boundary formed between tensile and compressive stress was inconsistent with the glide direction of stacking fault. Subsurface damage decreased as the increase of rake angle, and regularglide planes of stacking faults were found in front of the cutting tool. Further, the pinned dissociated 1/2 < 110 > superpartialdislocation with anti-phase boundary was demonstrated. The model was tested and characterized by implanted pits onperfect surface. Results showed that surface roughness can be well characterized, and an evident discrepancy was observedamong three rake angles, especially for 30° rake angle, which showed an distinct smooth surface compared with the others.