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서혜성 ( Haesung Seo ),최영수 ( Youngsoo Choi ),노상욱 ( Sanguk Noh ),최경희 ( Kyunghee Choi ),정기현 ( Gihyun Jung ) 한국인터넷정보학회 2006 인터넷정보학회논문지 Vol.7 No.3
인터넷을 사용하는 사람들에게 그들의 관심사와 부합하는 웹 페이지를 제공하는 것은 매우 중요하다. 이러한 관점에서 본 논문은 각 웹 페이지의 주제와 연관된 정도를 계산하여 웹 페이지 군(cluster)을 형성하며, 단어빈도/문서빈도, 엔트로피(entropy) 및 컴파일된 규칙을 이용하여 수집된 웹 페이지를 정제하는 주제 기반 웹 수집기를 제안한다. 실험을 통하여 주제 기반 웹 수집기에 대한 분류의 정확성, 수집의 효율성 및 수집의 일관성을 평가하였다. 첫째, C4.5, 역전파(back propagation) 및 CN2 기계학습 알고리즘으로 컴파일한 규칙을 이용하여 실험한 웹 수집기의 분류 성능은 CN2를 사용한 분류 성능이 가장 우수 하였으며, 둘째, 수집의 효율성을 측정하여 각 범주별로 최적의 주제 연관 정도에 대한 임계값을 도출할 수 있었다. 마지막으로, 제안한 수집기의 수집정도에 대한 일관성을 평가하기 위하여 서로 다른 시작 URL을 사용하여 수집된 웹 페이지들의 중첩정도를 측정하였다. 실험 결과에서 제안한 주제 기반 웹 수집기가 시작 URL에 큰 영향을 받지 않고 상당히 일관적인 수집을 수행함을 알 수 있었다. It is desirable if users surfing on the Internet could find Web pages related to their interests as closely as possible. Toward this ends, this paper presents a topic-specific Web crawler computing the degree of relevance, collecting a cluster of pages given a specific topic, and refining the preliminary set of related web pages using term frequency/document frequency, entropy, and compiled rules. In the experiments, we tested our topic-specific crawler in terms of the accuracy of its classification, crawling efficiency, and crawling consistency. First, the classification accuracy using the set of rules compiled by CN2 was the best, among those of C4.5 and back propagation learning algorithms. Second, we measured the classification efficiency to determine the best threshold value affecting the degree of relevance. In the third experiment, the consistency of our topic-specific crawler was measured in terms of the number of the resulting URLs overlapped with different starting URLs. The experimental results imply that our topic specific crawler was fairly consistent, regardless of the starting URLs randomly chosen.
Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects
Haesung Park,Hankyeol Seo,Sarah Eunkyung Kim 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.5
Cu–Cu bonding is a key process in fine pitch Cu interconnect in 3-dimenssional Si integration. Despite the excellent electricalproperty and pattern ability of Cu material, the Cu–Cu bonding process is affected by the high bonding temperature and easyoxidation. Thus, the ability to protect the copper surface in a reactive air environment is very important in Cu–Cu bonding,especially for die–to–wafer Cu bonding applications. We studied Cu–Cu bonding using a copper nitride nanolayer as anantioxidant passivation layer and investigated the stability of the copper nitride nanolayer over 7 days and its decompositioncapability across temperatures of up to 400 °C. We found that the copper nitride (Cu4N) nanolayer formed by two-step Ar/N2 plasma treatment protected the copper surface from further oxidation in the air, and that the energy required for thermaldecomposition of the copper nitride nanolayer in this study was about 29.6 kJ/mol. It can be seen that the bonding temperatureof Cu–Cu bonding can be sufficiently lowered by using a low–temperature decomposition property of copper nitride.
접시형 태양열 집광 시스템을 이용한 열화학 사이클의 수소생산
권해성(Haesung Kwon),신예원(Yewon Shin),오상준(sangjune Oh),서태범(Taebeom Seo) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.10
The two-step water splitting thermochemical cycle is composed of the T-R (Thermal Reduction) and W-D (Water Decomposition) steps. The reaction temperature necessary for this thermochemical cycle can be achieved by a dish-type solar thermal collector. The purpose of this study is to validate a water splitting device in the field. The validation results show that the foam device, when loaded with NiFe2O4/m-ZrO2 powder, was successfully achieved hydrogen production with 9 repeated cycles under field conditions. Two foam device used in this study were tested for validation before an experiment was performed. The lab scale ferrite-conversion rate was in the range of 24~76%. Two foam devices were designed to for structural stability in this study. In the results of the experiments, the hydrogen percentage of the weight of each foam device was 6.145 and 6.228 NL/(kg·h) on average, and the conversion rates 4.49~29.97 and 2.55~58.83%, respectively.
Calibration Method for INS Based on Multiple Actuator Function
Yeong-Bin Seo,Haesung Yu,Myeong-Jong Yu 제어·로봇·시스템학회 2023 International Journal of Control, Automation, and Vol.21 No.1
This paper presents a calibration method based on a multiple actuator function (MAF) to improve the navigation performance of the inertial navigation system (INS). The navigation performance of the INS can be improved by utilizing a compensation function. Existing calibration methods model the compensation function based on calibration coefficients obtained by indirect calibration. In indirect calibration, the calibration coefficients are calculated using acceleration errors. However, errors such as random walks, white noise, and bias instability can affect the precision of the calculated calibration coefficients. These errors can degrade the accuracy of the calibration coefficients and the compensation function. To overcome these limitations, the proposed method models a compensation function based on the MAF. The accuracy of the compensation function is improved by the accurate actuator angle and actuator position of the MAF. Unlike indirect calibration, the precision of the MAF is improved exclusively by navigation performance. The accurate actuator angle is calculated by adopting gradient descent and Q-learning, and the accurate actuator position is calculated by adopting the Bhattacharyya coefficient. The accuracy and precision of the proposed calibration method is evaluated by static-state tests and vehicle tests. The results show that the proposed calibration method is a valid approach to improve the navigation performance of the INS.
Yeong-Bin Seo,Haesung Yu,Myeong-Jong, Yu,Sang Jeong Lee 제어로봇시스템학회 2018 제어로봇시스템학회 국제학술대회 논문집 Vol.2018 No.10
In this paper, a new compensation method for hysteresis bias error of the ring laser gyroscope (RLG) is proposed. Deep neural networks using temperature and rate of temperature is applied to obtain the RLG bias. In the process of entering the deep neural networks, temperature and rate of temperature are split into several factors for higher accuracy. Through entering these factors to the deep neural networks, more accurate estimation performance is achieved than simply entering the temperature and rate of temperature. The RLG bias estimating performance of deep neural network is evaluated through comparing with various methods – 3rd order function, classic rate of temperature method, and radial basis function network (RBFN). The experimental results show that the proposed compensation method has more precise calibration performance than others.
프로젝트형 거꾸로 교실이 예비 영어교사들의 정의적 태도 및 메타인지 학습전략에 미치는 효과
송해성(Sohng HaeSung),서숙영(Seo SukYoung) 한국영어어문교육학회 2016 영어어문교육 Vol.22 No.2
The flipped classroom is a learner-centered teaching and learning method, in which the traditional classroom model is reversed. When a classroom is reversed, instruction is delivered outside of class, usually in the form of video lectures and active learning takes place in class. In this study, project-based learning was combined with the flipped classroom to explore its effects on the affective attitude and metacognitive learning strategies of pre-service teachers of English (n=31). A survey of 25 items was given at the beginning and at the end of a 15-week semester during which subjects were taking a class of the project-based flipped classroom. The results show that the project-based flipped classroom had the strongest positive effect on increasing students’ confidence in learning, followed by participation and interest. However, no significant effects were found on students’ metacognitive learning strategies. Further, students were satisfied with the way the project-based flipped classroom worked. These results suggest that the project-based flipped classroom could be an effective method to improve students’ learning ability.
서한결,박해성,김사라은경,Seo, Hankyeol,Park, Haesung,Kim, Sarah Eunkyung 한국마이크로전자및패키징학회 2020 마이크로전자 및 패키징학회지 Vol.27 No.1
As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO<sub>2</sub> hybrid bonding.