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Sustainable Living in the Global Village : A Common Value for Family, Community and Human Enterprise
Reith, Charles C.,Brennan-Reith, Nancy S. 선문대학교 통일사상연구원 1997 통일사상 연구논총 Vol.3 No.-
These elements of sustainable development are ordinarily applied to larger enterprises such as agriculture, forestry, mining, and industrial development. The premise of this paper is that the underlying ethic-the obligation to preserve or enhance opportunity for our colleagues here on earth-is an unambiguous credo that may be meaningfully applied to all human endeavor, from child-rearing to international diplomacy.
Shin, Ho Sun,Hamdou, Bacel,Reith, Heiko,Osterhage, Hermann,Gooth, Johannes,Damm, Christine,Rellinghaus, Bernd,Pippel, Eckhard,Nielsch, Kornelius The Royal Society of Chemistry 2016 Nanoscale Vol.8 No.28
<P>We systematically investigated the role of topological surface states on thermoelectric transport by varying the surface-to-volume ratio (s/v) of Bi2Se3 nanowires. The thermoelectric coefficients of Bi2Se3 nanowires were significantly influenced by the topological surface states with increasing the s/v. The Seebeck coefficient of Bi2Se3 nanowires decreased with increasing the s/v, while the electrical conductivity increased with increasing the s/v. This implies that the influence of metallic surface states become dominant in thermoelectric transport in thin nanowires, and the s/v is a key parameter which determines the total thermoelectric properties. Our measurements were corroborated by using a two-channel Boltzmann transport model.</P>
Wimmer, Erich,Christensen, Mikael,Eyert, Volker,Wolf, Walter,Reith, David,Rozanska, Xavier,Freeman, Clive,Saxe, Paul The Korean Ceramic Society 2016 한국세라믹학회지 Vol.53 No.3
Electronic structure calculations have become a powerful foundation for computational materials engineering. Four major factors have enabled this unprecedented evolution, namely (i) the development of density functional theory (DFT), (ii) the creation of highly efficient computer programs to solve the Kohn-Sham equations, (iii) the integration of these programs into productivity-oriented computational environments, and (iv) the phenomenal increase of computing power. In this context, we describe recent applications of the Vienna Ab-initio Simulation Package (VASP) within the MedeA$^{(R)}$ computational environment, which provides interoperability with a comprehensive range of modeling and simulation tools. The focus is on technological applications including microelectronic materials, Li-ion batteries, high-performance ceramics, silicon carbide, and Zr alloys for nuclear power generation. A discussion of current trends including high-throughput calculations concludes this article.