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Simplified Thin Film Processes in a Facility With Mini-environments
Ahn, Kie Y.,Gallo, A. R.,Greiner, J. H.,Magerlein, J. H.,Nunes, S. L. 대한전자공학회 1993 ICVC : International Conference on VLSI and CAD Vol.3 No.1
Thin film wiring processes for applications in MCM-D were investigated in an ultramodern facility equipped with mini-environments for process tools, robots for substrate handling, and SMIF (Standard Mechanical Interfaces) pods for substrate transport between tools. In this paper key features of various thin film processes are summarized along with electrical test results of a specially designed test vehicle consisting of 6x6 cells on an optically flat substrate (166 mm square) having X- and Y-conductors with varying line widths ranging from 6 to 10 ㎛um, via chains, and other test patterns.