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Xuan Hung Nguyen,Byung-ho Sung(성병호),Jeehoon Choi(최지훈),Junghyung Yoo(유정현),Minwhan Seo(서민환),Chulju Kim(김철주) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.