수도 생육후기 광합성 능력과 영양환경이 건물생산과 수량구성요소에 미치는 영향

이주열,Joo-Yul Lee 한국작물학회 1976 한국작물학회지 Vol.21 No.2

출수기전후 수도의 광합성능화과 생육상태의 차이가 건물생산과 수량구성요소에 미치는 영향을 구명하고 통일품종의 출수전 저장물질과 출수후 축적 물질이 현미수량을 구성함에 있어서 차지하는 의존도를 재배시기를 달리한 상태에서 조사한바 그 성적을 요약하면 다음과 같다. 1. 등숙기의 광합성능력은 품종간에 차이를 보여 광합성능력이 비교적 높은 품종군(만경, 농림 2002, 동산 38호 Kotominori)과 낮은 품종군(진흥 팔금 통일 금남풍)으로 구별되였으며 그중 진흥 Kotominori 양품종은 수전기에서 유숙기에걸쳐 광합성능력의 저하가 심하였으며 시비법의 차이에 의한 광합성능력의 변동도 큰편이였다. 2. 출수후 광합성능력과 엽신질소함량및 엽중비율(엽신건물중/전건물중)간에는 정의 상관이 인정되었으며 일본품종은 한국 품종에 비하여 그들간의 상관이 더욱 높고 엽신질소함량도 높았다. 3. 수전기로부터 유숙기까지의 근활력소장은 광합성능력 단백태질소함량과도 상호밀접하게 관계하여 수전기에서 유숙기에 걸쳐 근의 산화력이 높은 것은 이삭의 건물증가량을 많게하고 최종적으로는 수량에도 영향하는 것으로 추찰되였다. 4. 공시품종들의 출수전저장탄수화물량과 출수후 탄수화물생산량에 의한 현미구성비율은 출수전 저장 탄수화물에 의존도가 15~26%에 불과하고 나머지 74~85는 출수후 탄수화물 생산량에 의존하고 있다. 5. 수전기의 엽신질소함량과 주당 영화수와의 관계를보면 한국품종군과 일본품종군간에는 2계열의 정의 상관이 인정되었고 시비법 차이에 의한 $\textrm{m}^2$당 영화수는 한국품종군에서는 후기중점 시비구가 일본품종군에서는 기비중점 시비구가 많은 결과를 보여주었다. 6. 출수기를 전후한 건물중과 엽면적은 이앙기가 빠를수록 높은 수치를 보였으며 엽면적 엽량 공히 출수전 3주간에 있어서는 건물증가율과 정의 상관이 인정되여 동기간에 있어서의 건물증가율의 차이는 엽면적의 차에 의하여 직접규제되나 출수후등숙에 접어들면서 엽면적의 직접적인 지배성은 점차로 소실되어 감을 알수 있었다. 7. 현미구성에 있어 출수전 저장동화물질과 출수후 생산된 동화물질에 의존비율은 이앙기가 빠를수록 그리고 엽신 N함량이 많을수록 출수전 저장동화물질에 의존도가 높아 재배시기이동에 의한 환경조건변화로 통일품종의 등숙향상과 수량증대가 가능함을 뒷받침하여 주었다. 8. 8월 17일 출수기를 중심으로 그이전에 출수한 구에서는 저장기간중 일사량 및 일조시간이 많고 평균기온도 높은 양호한 기상조건하에서 경과하게되여 현미구성에 있어 출수전 저장동화물질에 의존도를 높일수 있었다고 본다. 9. 이상의 출수전후 집적량과 기상환경과의 상관을 맺어본 결과 출수전 동화물질 저장량과 출수전 3주간의 평균일사량 일조시수 평균기온과는 고도의 정의 상관이 있었다. Experiment were conducted to study the photosynthetic ability of several rice varieties and the influence of the drymatter production on the yield components of the rice plant, especially in ripening period. The photosynthetic ability at the ripening period, the varieties were classified into two groups as relatively high capacity and low capacity. With the earlier the transplanting date and the higher the N-content leaf blade, the greater the ratio of reserved assimilates befere heading time to the ear. This could be support the fact that the rate of full-ripened grains or grain yield of 'Tongil' variety may increased by the change of environment condition.condition.

3가크롬 이온의 전착 반응에 용액 산도 및 유기물 첨가제가 미치는 영향 연구

이주열(Joo-Yul Lee),Nguyen Van Phuong,강대근(Dae Keun Kang),김만(Man Kim),권식철(Sik Chol Kwon) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.6

The effect of solution acidity and organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was systematically investigated in the view point of electroreduction of trivalent chromium ions and solution stability. It was found that solution acidity controlled at pH 2.5 showed the widest current range for bright electrodeposits in the presence of PEG additives, which reduced the local current intensification at high current densities. Through complex interaction between PEG additives and hydrogen ion, that is, solution acidity, electrode potential was moved in the negative direction in the bulk solution, while it shifted in the positive when electric potential was scanned. In conjunction with electrochemical quartz crystal microbalance (EQCM), it was found that PEG additives had a role in promoting the electron transfer to trivalent chromium ion complexes in bulk solution and their adsorption at the electrode surface as well as interfering with hydrogen ion reduction process below pH 2.5. The PEG additives developed the nodular morphology during electroreduction of trivalent chromium ions with the increase of solution acidity and enhanced its current efficiency by maintaining the consumption of complexant, formic acid, at low speed.

구연산 기반 구리-니켈 합금도금에 대한 분광학적/전기화학적 특성 연구

이주열(Joo-Yul Lee),임성봉(Seong-Bong Yim),김만(Man Kim),정용수(Yongsoo Jeong) 한국표면공학회 2011 한국표면공학회지 Vol.44 No.3

We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UVVisible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of Ni<SUP>2+</SUP>-citrate pair was completed at lower solution pH than Cu<SUP>2+</SUP>-citrate pair and was affected by the coexistent Cu<SUP>2+</SUP> ions, while the complexation between Cu<SUP>2+</SUP> ions and citrate was not sensitive to the presence of Ni<SUP>2+</SUP> ions. Also, the electron transfer from cathode to Cu<SUP>2+</SUP>-citrate and Ni<SUP>2+</SUP>-citrate was hindered by strong complexation between Cu<SUP>2+</SUP>/Ni<SUP>2+</SUP> ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of Cu<SUP>2+</SUP> ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.

구리 전기 도금에 Thiourea가 미치는 효과

이주열(Joo-Yul Lee),임성봉(Seong-Bong Yim),황양진(Yang Jin Hwang),이규환(Kyu Hwan Lee) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.6

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

Polyethylene glycol이 3가크롬 전기도금에 미치는 효과

이주열(Joo-Yul Lee),Nguyen Van Phuong,임성환(Sung-Hwan Lim),한승전(Seung Zeon Han),권식철(Sik Chol Kwon) 한국표면공학회 2011 한국표면공학회지 Vol.44 No.1

The effect of organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was analysed in the view point of current efficiency, solution stability and metallurgical structure. It was measured that PEG-containing trivalent chromium solution had about 10% higher current efficiency than pure solution and controlled the micro-crack density of electrodeposits. PEG exhibited profound effect on the solution stability by reducing the consumption rate of formic acid which acts as a complexant to lower the activation energy required for electrochemical reduction of trivalent chromium ions. It was also revealed that the formation of chromium carbide layer was facilitated in the presence of polyethylene glycol, which meant easier electrochemical codeposition of chromium and carbon, not single chromium deposition. Trivalent chromium layer formed from PEG-containing solution was amorphous with local nano-crystalline particles, which were prominently developed on the entire surface after non-oxidative heat treatment.

연속전주공정을 이용한 전자파 차폐용 정밀니켈메쉬 제조 신공정

이주열(Joo-Yul Lee),김만(Man Kim),권식철(Sik-Chol Kwon),Nguyen Viet Hue,김인곤(In-gon Kim) 한국표면공학회 2005 한국표면공학회지 Vol.38 No.6

Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

용액 교반이 미세 패턴 내 무전해 구리 도금에 미치는 영향

이주열(Joo-Yul Lee),김만(Man Kim),김덕진(Deok-Jin Kim) 한국표면공학회 2008 한국표면공학회지 Vol.41 No.1

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of 130-80 ㎚ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

유기물 첨가제가 마이크로 패턴 구리 전주 도금에 미치는 영향 연구

이주열(Joo-Yul Lee),김만(Man Kim),이규환(Kyu Hwan Lee),임성봉(Seong-Bong Yim),이종일(Jong Il Lee) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.1

The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a role as a n accelerator and TU as an inhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ㎛-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.

Naphthalene Trisulfonic Acid가 니켈 전착층의 표면 특성에 미치는 영향

이주열(Joo-Yul Lee),김만(Man Kim),권식철(Sik-Chol Kwon),김정환(Jung-Hwan Kim),김인곤(In-gon Kim) 한국표면공학회 2006 한국표면공학회지 Vol.39 No.1

The effects of an organic additive, naphthalene trisulfonic acid (NTSA), contained in the nickel sulfamate bath on the surface properties of the electrodeposited nickel layer were investigated through electrochemical technique, x-ray diffraction analysis, and microscopic observation. The addition of NTSA facilitated the oxidation process of electrodeposited nickel layer during anodic scan and also increased the hardness and internal stress of the nickel film as the applied current density became higher. It seems that NTSA modulated the deposit structure during electrodeposition and so induced higher distribution of (110) orientation with respect to (200). With the increase of the NTSA in the bath, nickel layer was formed in small grain size, which resulted in enhanced surface evenness and brightness.

핵심 건강지표와 서울시 보건소 건강증진사업 내용의 일치성 분석

이용주(Yong Joo Rhee),이주열(Ju Yul Lee),송선우(Sun Woo Song) 한국보건교육건강증진학회 2015 보건교육건강증진학회지 Vol.32 No.2