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        An efficient approach to fabricate lightweight polyimide/aramid sponge with excellent heat insulation and sound absorption performance

        Shunxi Song,Yujie Shi,Jiaojun Tan,Zeshi Wu,Meiyun Zhang,Sheng Qiang,Jingyi Nie,Haitang Liu 한국공업화학회 2022 Journal of Industrial and Engineering Chemistry Vol.109 No.-

        Polyimide sponges have bright prospects in the weight reduction, heat insulation, and sound absorptionequipment of aerospace, navigation, and other area due to their unique three-dimensional cellular structureand outstanding comprehensive performance. However, most polyimide sponges suffered from longand complex fabrication processes. Herein, an efficient and scalable approach, i.e. water-based foamforming, was proposed to fabricate ultralight and porous polyimide/aramid sponges (PASG). Attributedto the bubble-template nature of foam-forming, PASGs exhibit high porosity (>99%) and ultra-low density(10 mg/cm3), and possess excellent thermal and sound insulation performance with an optimum thermalconductivity of 34.89 mW/mK and noise reduction coefficient of 0.41. Besides, PASGs demonstrateoutstanding mechanical properties after 500 compression cycles. This strategy providing more possibilitiesfor developing the next generation of high-performance thermal insulation and noise reductionmaterials.

      • KCI등재

        A novel and effective approach to enhance the interfacial interactions of meta-aramid fibers

        Hui Zhang,Xiaoyun Du,Jiawei Liu,YunHong Bai,Jingyi Nie,Jiaojun Tan,Zhibin He,Meiyun Zhang,Jinbao Li,Yonghao Ni 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.120 No.-

        Meta-aramid paper exhibits some unique properties, including high temperature resistance, electricalinsulation. However, due to the inherent chemical inertness of aramid fibers, the interfacial bondingbetween fibers is weak, which negatively affect the properties of aramid paper. Herein, we report a simple,effective and scalable process for substantially improving the interfacial bonding between aramidfibers, thus, mechanical and insulating properties of the meta-aramid composite paper, and it wasachieved by surface coating of aramid paper with meta-aramid stock solution that contains N, N dimethylacetamide(DMAc)-CaCl2 and high molecular weight poly (m-phenylene isophthalamide) polymers. Results show that the tensile strength, modulus, internal bond strength and tearing index of the resultantall-PMIA paper increased by 83 %, 58 %, 173 % and 89 %, respectively, in comparison with those of the control. The breakdown strength of the improved aramid paper is 190 % higher than that of the control paper,attaining 26.46 KV/mm. This work provides a simple, economical, efficient, and scalable method toimprove the overall performance of meta-aramid paper, which has great potential to be implementedat the industrial scale.

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