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Temperature-Dependent Structural and Transport Properties of Liquid Transition Metals
Sui Yang,Xuping Su,Jianhua Wang,Nai-Yong Tang 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.6
The evolution of the atomic structures and diffusivity of liquid transition metals with increasing temperature has been studied here using molecular dynamics. An analysis of Honeycutt and Andersen (HA) Indices indicates that relatively low order atomic clusters of rhombohedra-related structures increase with an increase in temperature. The results illustrate that the distortion in the local structural order with a predominant rhombohedra character enhances the diffusivity in liquid metals. The excess entropy approximated by the two-body contribution increases with the distortion of the local structural order traced by the HA Indices. The relationship between the excess entropy and the reduced diffusion coefficient supports the universal scaling law proposed by M. Dzugutov. The calculated diffusivities were compared with predictions of four diffusion models. The temperature dependence of the diffusivity cannot be described by the Arrhenius Law, the moving oscillator model or the free volume model but rather by the density fluctuation model with the square proportionality of temperature.
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Mechanical and Thermal Properties of Epoxy Resins Modified by a Novel Thermoplastic-polyimide
Yu Ji,Yan Zhang,Ping Wang,Yuanyuan Li,Jianhua Sui 한국섬유공학회 2021 Fibers and polymers Vol.22 No.1
In this paper, a novel polyimide with trifluoromethyl group (PIS) was synthesized successfully and used toimprove the toughness of epoxy resins. Five modified epoxy resins (5, 7.5, 10, 12.5 and 15 wt%) were prepared andinvestigated, respectively. The structure, thermal properties, tensile properties, viscoelastic properties, toughness andmorphology of modified epoxy resins were studied by Fourier Transform Infrared Spectroscopy (FT-IR), thermogravimetricanalysis (TGA), Instron 5967, Dynamic Mechanical Analysis (DMA), and Scanning Electron Microscopy (SEM). Theresults showed that the epoxy resins modified with PIS exhibited good thermal stability which the glass transitiontemperatures increased from 135.9 oC to 146.4 oC. Tensile strength of modified epoxy resins increased from 40.4 MPa to92.3 MPa. The KIC values increased from 0.86 MPa·m1/2 to 1.56 MPa·m1/2 indicated that the toughness enhancement wasmarkedly. The fracture modes also were examined by SEM images and exhibited the fracture mode changed from the brittleone to ductile fracture with varied weight of the novel trifluoromethyl-polyimide.
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