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Shin, Je-sik,Moon, Hyung-kwon,Kim, Bong-hwan,Kim, Kyung-hoon,Lee, Hyo-soo,Jung, Seung-boo,Kwon, Hyouk-chon Elsevier 2011 Current Applied Physics Vol.11 No.1
<P><B>Abstract</B></P><P>In this study, it was aimed to develop a novel interconnect material simultaneously possessing high electrical conductivity and strength. Cu composite sheets were fabricated by forming the high electrical conduction paths of Ag on the surface of high strength Cu alloy substrates by damascene electroplating. As a result, the electrical conductivity increased by 40% thanks to mesh type Ag conduction paths, while the ultimate tensile strength decreased by 20%. Because of macro damascene interface profile, the peel strength of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. As Ag conduction path became finer, pressing formability improved. Al wire wedge bonding was able to be carried out without bondable pads patterning process.</P>
The influence of surface-activated bonding treatment on the peel strength of Cu-Ni metal clad.
Kim, Kyung Hoon,Lim, Sung Chul,Kwon, Hyouk Chon American Scientific Publishers 2013 Journal of Nanoscience and Nanotechnology Vol.13 No.5
<P>Three different conditions of surface activation bonding, 0.5 m/min, 1.0 m/min and 1.5 m/min surface activation treatment speed, on copper and nickel substrate were investigated from the view point of adhesion of Cu-Ni clad metal. The specimen treated with surface activation treatment speed 1.0 m/min (Sample B) had higher peel strength properties than 0.5 m/min (Sample A) which has more long plasma treatment time. Observing the interface of clad with TEM and XPS spectra, sample B has relatively thin oxide interface including Cu2O and sample A has thick oxide interface including CuO. From these result, it is suggested that the better adhesion of Cu-Ni clad on the SAB process is not due to the increase of plasma treatment exposure time but due more to the control of forming condition as much as thin Cu2O layer growing epitaxial form.</P>
Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding
Kim, Kyung Hoon,Hong, Soon Hyung,Cha, Seung Il,Lim, Sung Chul,Kwon, Hyouk Chon,Yoon, Won Kyu The Japan Institute of Metals 2010 MATERIALS TRANSACTIONS Vol.51 No.4
<P>The effects of surface roughness and heat treatment on the bonding quality of surface-activated bonding (SAB)-treated copper-nickel fine clad metals were investigated. An increase in the surface roughness of the copper layer decreased the peel strength after cladding, indicating that increases in the surface roughness decreased the contact area between the clad materials in the SAB cladding process, unlike conventional cold rolling that induces high deformation. In addition, the peel strength of the clad metals increased up to 7.3 N/mm with decreasing surface roughness of the copper layer after heat treatment. The change in the total sheet resistance of the copper-nickel clad metal with the heat treatment depended on the balance between a decrease in the sheet resistance due to the reduction of dislocation and the increase in the heat treatment temperature, and an increase in the sheet resistance due to the diffusion of nickel in the copper direction.</P>
Sangwoo Kim,방재훈,최명식,Wansik Oum,Ali Mirzaei,Namgue Lee,Hyouk‑Chon Kwon,Dohyung Lee,Hyeongtag Jeon,Sang Sub Kim,Hyoun Woo Kim 대한금속·재료학회 2019 METALS AND MATERIALS International Vol.25 No.3
We report the gas-sensing properties of pristine and SnS2functionalized TeO2nanowires (NWs). TeO2NWs were synthesizedby a vapor–liquid–solid growth method, and SnS2functionalization was performed using an atomic layer depositiontechnique followed by thermal treatment. Structural and morphological analyses verified the formation of pristine and SnS2functionalized TeO2NWs with desired composition, phase, and morphology. Interestingly, sensing results showed that thepristine TeO2NW gas sensor had better sensing properties relative to the SnS2functionalized TeO2NW gas sensor. Anunderlying sensing mechanism is explained in detail, and reasons for the decrease of sensing performance with the SnS2functionalized TeO2NW sensor was attributed to the coverage of TeO2surface by the SnS2nanoparticles.
Microstructure and properties of cross-roll rolled and heat treated metastable TiNbSn alloy.
Jung, Taek-Kyun,Choi, Ho-Joon,Kim, Kyung-Taek,Shin, Young-Chul,Lee, Hyo-Soo,Lim, Sung-Chul,Kwon, Hyouk-Chon,Hanada, Shuji American Scientific Publishers 2014 Journal of Nanoscience and Nanotechnology Vol.14 No.10
<P>A (Ti-35mass%Nb)-4mass%Sn alloy was cross-roll rolled with a reduction ratio of 70% in which the roll axes are tilted by 5 degrees away from the transverse direction of the rolled sample and then aged at 250 degrees C for 2 h. Cross-roll rolling was found to increase yield strength and Young's modulus, simultaneously. Yield strength was higher in cross-roll rolled than in conventionally rolled at same reduction ratio. Yield and tensile strength further increased by a low temperature ageing by ψ precipitation hardening and microstructure refinement. Yield and tensile strength of the aged 70% cross-roll rolled sample were higher than those of the aged 70% conventionally rolled one.</P>
( Hyeong Won Shin ),( Hai Joong Lee ),( Ji Hee Kim ),( Seul Ly Koo ),( Yeo Reum Lee ),( Jae Ha Kim ),( Myung Sik Choi ),( Su Jin Park ),( Sang Woo Kim ),( Hyo Soo Lee ),( Hyouk Chon Kwon ) 한국감성과학회 2015 추계학술대회 Vol.2015 No.-
Recently, the emotional consumption has been a crucial factor in purchasing. The emotional consumption is that the consumer makes a choice heading toward satisfaction of five senses such as sighting, hearing, touching, tasting and smelling in buying auto-vehicles, mobiles, home appliances and so on. Particularly, the color stimulating human eye is significant valuable of its choice. Variation of color of metal alloys was investigated in this study by its morphology without using organic and inorganic surface coatings. We quantitatively analyzed the reflectivity according to the wavelength of Copper alloys and ΔE. We used copper alloys containing Sn, Zn and alloyed variously to 4%, 14% and 28%, respectively. And the relationship between color gradation of copper alloy and CIE 1976 Luv color chart was suggested in solid solution, intermetallic of Cu-Sn and Cu-Zn alloy in this study.