광센서를 위한 ZnO:Al 투명도전막의 제조 및 특성연구

박기철,이형기,심호섭 경북대학교 센서기술연구소 1995 연차보고서 Vol.1995 No.-

RF 마그네트론 스퍼터링법으로 AZO(ZnO:Al)막을 증착시켰다. 타겟내의 Al_2O_3의 첨가량, 기판온도, 분위기압, RF출력 등의 증착조건의 변화에 따라 제조된 AZO막의 조성, Al 도핑양, 구조적 특성 등을 XRD, SEM, EDS 및 RBS로 조사하였다. 이와 함께 전기적 및 광학적 특성을 Hall 효과 및 광투과도 특성을 통하여 조사하였다. 증착된 AZO막은 육방정의 wurtzite 구조였으며 모든 증착조건에서 기판에 수직으로 성장하는 (002)면 방향을 가지는 c-축배향성을 나타내었다. 증착된 AZO막내의 AB 도핑량은 타겟내의 무게비에 비례하였으며 Zn : O의 조성비토 1 : 1로 거의 일정하였다. 투명도전막으로서의 최적조건은 3wt%의 Al_2O_3이 첨가된 타겟으로 기판온도가 150℃, 분위기압이 2mTorr, RF출력이 150W로 증착한 경우였으며 이 때 비저항은 4.7×10 exp (4)Ω㎝, 캐리어 농도는 7.5×10 exp (20)㎝^-3이었다. 또 두께가 1500Å인 막의 경우 550㎚에서 광투고도가 90%이상이었으며 광학적 밴드갭은 3.53eV였다. Aluminium doped zinc oxide(AZO)films were prepared by RF magnetron sputtering method. The chemical compositions, doping concentrations, and the structural char-acteristics of the AzO films were studied in accordance with various deposition parameters, such as Al_2O_3 amount, substrate temperature and working pressure, by XRD, EDS, SEM and RBS. And The electrical and optical properties of AZO films were characterized by Hall effect and optical transmittance measurements. AZO films had were hexagonal wurtzite structure and dominent c-axis orientation. The Al doping concentration in the films were monotonically increased. The atomic ration of Zn : O were 1 : 1. The substrate, working pressure and rf power for optimum condition to fabricate the transparet conductive films using a target containing 3wt% Al_2O_3 were 150 ℃, 2mTorr and 150W, respectively. The resistivity and the carrier density of the AZO film prepared under this condition were 4.7 × 10 exp (-4) Ω㎝ and 7.5 × 10 exp (20) ㎝^-3, respectively. The optical transmittance of 1500 Å thick films at 550㎚ is ∼90% and optical energy band gap was 3.53eV.

A mark-release-recapture experiment with Anopheles sinensis in the northern part of Gyeonggi-do, Korea

Shin-Hyeong CHO,Hyeong-Woo LEE,E-Hyun SHIN,Hee-Il LEE,Wook-Gyo LEE,Chong-Han KIM,Jong-Taek KIM,Jong-Soo LEE,Won-Ja LEE,Gi-Gon JUNG,Tong-Soo KIM 대한기생충학열대의학회 2002 The Korean Journal of Parasitology Vol.40 No.3

Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO₃ Composite Embedded Capacitor Films

Hyeong-Gi Lee,Kyung-Wook Paik IEEE 2015 IEEE transactions on components, packaging, and ma Vol.5 No.4

<P>Epoxy/BaTiO<SUB>3</SUB> composite embedded capacitor films (ECFs) were fabricated using dicyandiamide (DICY) as a curing agent and 3-(4-chlorophenyl)-1,1-dimethylurea as a curing accelerator to investigate the curing behavior and material properties of the ECFs with different curing systems and curing temperatures. The curing behaviors of the ECFs with three different curing systems were identified using differential scanning calorimeter analysis. The chemical structure changes of the ECFs were analyzed using Fourier transform infrared (FT-IR) spectroscopy. The intensity changes of a carbonyl peak in the FT-IR with different curing temperatures indicated that cyclization and hydrolysis reactions increased as curing temperature increased. In addition, the effect of this chemical structure change according to curing temperature was investigated in terms of glass transition temperature (T<SUB>g</SUB>), peel adhesion strength, and coefficients of thermal expansion. In the case of the ECF with low DICY content, the degree of cure increased as curing temperature increased and the improvement in the material properties of the ECF with low DICY content resulted mainly from the increase in the degree of cure. The material properties of the ECF with curing accelerator improved after the degree of cure reached 100% due to the low DICY amount and the addition of curing accelerator. However, the material properties of the ECF with high DICY content did not show improvement as curing temperature increased, because the dominance of the two primary amines of the DICY to cure promoted the cyclization and hydrolysis.</P>

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Hyeong Gi Lee,Ji-Won Shin,Yong-Won Choi,Kyung-Wook Paik IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.3

<P>In this paper, wafer-level preapplied nonconductive films (NCFs) were used to interconnect the Cu pillar/Sn-Ag microbumps for 3-D through silicon via vertical interconnection. Thermocompression bonding is a common method to interconnect chips to substrates using NCFs, and thermocompression bonding time should be reduced to increase the bonding productivity. Therefore, isothermal bonding method without heating and cooling process in bonding profile was introduced to reduce the bonding time. Solder joints bonded by an isothermal bonding method were compared to those joints bonded by a conventional ramp-up bonding method that was consist of heating, bonding, and cooling process. Final joint gap was decreased using an isothermal bonding method due to higher heating rate, and solder joint morphology was also changed according to the final solder joint gap. Furthermore, solder joint should have enough contact area to substrate metal pads without solder wetting on the Cu pillar sidewall to avoid reliability problems by Sn consumption at the solder joint. Effects of isothermal bonding parameters were investigated in terms of the bonding pressure, temperature, and time to optimize the isothermal bonding parameters for good solder joint. As bonding pressure and bonding temperature increased, solder joint gap decreased because final joint gap was determined by bonding pressures and dynamic viscosity of NCFs. Isothermal bonding times can be reduced to 10 s, because the degree-of-cure of NCFs could be over 90% after 2.2 s. As a summary, solder joint bonded with NCFs using optimized isothermal bonding parameters showed excellent bump joint resistances and solder wetting on substrate metal pads.</P>

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee,Yong-Won Choi,Ji-Won Shin,Kyung-Wook Paik IEEE 2015 IEEE transactions on components, packaging, and ma Vol.5 No.11

<P>The 3-D stacking technologies have been developed, because higher packaging density demands to populate more circuits or chips on smaller substrate areas. Among 3-D packaging technologies, the through silicon via (TSV) technology that uses Cu pillar/Sn-Ag microbumps to vertically interconnect between chips is the most advanced state-of-the-art packaging method. However, the conventional reflow process with flux and underfill for bonding using Cu pillar/Sn-Ag microbumps has problems, such as process complexity, flux residues entrapment, and voids trapping. In this paper, the B-stage nonconductive films (NCFs) have been introduced to simplify the bonding processes and avoid flux residues entrapment and voids trapping. In addition, wafer-level packages (WLPs) using NCFs for the 3-D-TSV microbump interconnection have also been investigated. At first, the wafer-level NCFs lamination was conducted without voids and bubbles formation on a wafer. And the effect of epoxy resin types on the adhesion and elongation properties of NCFs laminated on a wafer was also investigated to optimize the wafer dicing process using laminated NCFs. After NCF-laminated Cu/Sn-Ag bumped wafer was diced into a single chip, singulated chips were bonded on substrate chips using a flip chip bonder. The electrical properties and reliabilities of the WLP packages using NCFs were evaluated and compared with the conventional single flip chip packages. As a result, the WLPs using the B-stage NCFs showed the same electrical interconnection properties as those of the conventional single flip chip packages.</P>

대가야의 공간적 범위에 대한 고찰

이형기(Lee, Hyeong-gi) 한국고대사탐구학회 2019 한국고대사탐구 Vol.33 No.-

이 글은 대가야의 발전과정 속에서 공간적 범위를 설정하려 하였다. 필자는 1~3세기의 삼한소국단계를 지나 4세기의 지역연맹체단계, 5세기 이후의 대가야로 구분할 수 있다고 생각한다. 부족한 가운데 각각의 단계를 추정할 수 있게 해 주는 盤雲里瓦質土器遺蹟, 快賓洞古墳群, 池山洞古墳群등의 고고학 자료들이 확인되는 데서 그러하다. 이 글은 그 연장선에서 대가야사의 공간적 범위를 검토해 보고자 하였다. 시간적 범위는 5세기 이후 대가야로 접어든 무렵부터 멸망한 시기까지로 한정하여야 하지만 이를 위하여 가야의 개략적 범위와 대가야로 성장해 나가는 과정의 공간적 범위도 함께 살펴보았다. 그 결과 대가야가 부체제로 접어들었을 무렵에는 고령 중심지가 王都즉 上部로, 합천댐 상류지역인 봉산면 일대는 王畿= 下部로 편제되었고 이들은 대가야의 직할령이었다. 나머지 우륵12곡에 보이는 지명 중 거창, 남원일대의 지역은 지방으로 편입되었을 것으로 판단된다. 그렇지만 이들에 대한 직접지배는 이루어지지 않아서 기존 소국의 수장들은 자신의 지역에 대한 독자적인 지배가 가능하였다. 그러나 공간적 범위를 단계적으로 논하여야 함에도 거기 까지 논의를 진전시키지는 못하였다. 이는 아무래도 고고학 자료와는 달리 시기별로 범위를 설정할 수 있는 기록의 부재를 원인으로 돌려야 할 것 같다. 그럼에도 불구하고 지금까지의 논의 또한 영성한 자료들로 인해 많은 억측을 함께 할 수밖에 없었다. 선학들의 질정을 바란다. 로 범위를 설정할 수 있는 기록의 부재를 원인으로 돌려야 할 것 같다. 그럼에도 불구하고 지금까지의 논의 또한 영성한 자료들로 인해 많은 억측을 함께 할 수밖에 없었다. 선학들의 질정을 바란다. This article attempted to set the political range in the development of Daegaya(대가야). I divide the history of Daegaya into small stages of Byeonhan(변한) of the 1st and 3rd centuries, regional federations of the 4th century, and Daegaya after the 5th century. I classify them as archeological data such as the ruins of Banwoon-ri(반운리 와질토기유적), Koaebin-dong tombs(쾌빈동고분군) and Jisan-dong tombs(지산동고분군). The temporal range of this article, along with the range of the history of Gaya(가야), was about until the berging of Daegaya. By the time Daegaya entered Busystem(부체제), Goryeong(고령) as Sang-bu(상부, =the capital), Bongsnamyeon(봉산면) of Hapcheon-gun county(합천군) as Ha-bu(하부), and Geochang-gun(거창군), Namwon-si(남원시) were incorporated into local governance system. This article has a lot of speculation due to the lack of feed. I wish you much teaching.

가야문화권 박물관 현황과 과제

이형기 ( Lee Hyeong Gi ) 부경역사연구소 2003 지역과 역사 Vol.- No.12

There are national and public museums and university museums in Gaya cultural area. The university museums of them have played a leading role in excavation. They should take charge of the education to train the professionals who will work in the national and public museums. And they have to contribute to the academic world by exhibiting the relics according to theme. This present, it is very encouraging situation that being constructed public museums in each area within Gaya cultural area. However, the number of the professional is shorted and the status of the curator is precarious in the public museums. Moreover, it is bent upon its administration, maintenance of the status quo, consequently the self-improvement of the curator and the project of the exhibition programmes are almost never performed actually. To solve this problem, first, it is necessary to guarantee the status of the curators. Secondly, the organization of the places is required, where the curators are able to exchange and shared information. Thirdly, the budget support of the government is need to operate various programmes. If that happens, the characteristics of the museum should be maintained and developed.

Two newly recorded species of Pyraustine moths (Lepidoptera: Crambidae) in Korea

Tak-Gi Lee,Dong-June Lee,Ulziijargal Bayarsaikhan,Hyeong-Kyu Kim,Yeong-Bin Cha,Sol-Moon Na,Young-Min Shin,Bo-Sun Park,Yang-Seop Bae 한국농약과학회 2018 한국농약과학회 학술발표대회 논문집 Vol.2018 No.10

First report of the subfamily Cybalomiinae Marion, 1955 (Lepidoptera, Crambidae) in Korea

Tak-Gi Lee,Sol-Moon Na,Dong-June Lee,Ulziijargal Bayarsaikhan,Hyeong-Kyu Kim,Yeong-Bin Cha,Chang-Mun Jang,Yang-Seop Bae 한국응용곤충학회 2018 한국응용곤충학회 학술대회논문집 Vol.2018 No.04

Cybalomiinae is a small subfamily of the family Crambidae, reporting 18 genera, 122 species in the world. However, this subfamily of species are still included in subfamily Pyraustinae in Korea with two species: Trichophysetis cretacea (Butler, 1879) and T. rufoterminalis (Christoph, 1881). Recently, these species transferred to Cybalomiinae by Shaffer et al. (1996). However, it was not considered in Korea. In the present study, we report the subfamily Cybalomiinae from Korea for the first time, with a newly recorded genus. Illustrations of adults, male and female genitalia, diagnosis, description are provided.

스텐트 삽입술 후 수술적 절제수로 치료한 특발성 기관 협착증

이형노 ( Lee Hyeong No ),조혜진 ( Jo Hye Jin ),이종우 ( Lee Jong U ),신승수 ( Sin Seung Su ),오윤정 ( O Yun Jeong ),박광주 ( Park Gwang Ju ),황성철 ( Hwang Seong Cheol ),최호 ( Choe Ho ),이기범 ( Lee Gi Beom ) 대한결핵 및 호흡기학회 2002 Tuberculosis and Respiratory Diseases Vol.53 No.4