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Dynamic Self-Repair Architectures for Defective Through-silicon Vias
양준성,한태희,Darshan Kobla,Edward L. Ju 한국전자통신연구원 2014 ETRI Journal Vol.36 No.2
Three-dimensional integration technology results inarea savings, platform power savings, and an increase inperformance. Through-silicon via (TSV) assembly andmanufacturing processes can potentially introduce defects. This may result in increases in manufacturing and testcosts and will cause a yield problem. To improve the yield,spare TSVs can be included to repair defective TSVs. Thispaper proposes a new built-in self-test feature to identifydefective TSV channels. For defective TSVs, this paperalso introduces dynamic self-repair architectures usingcode-based and hardware-mapping based repair.