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실리콘 웨이퍼 직접 접합(SDB)에서 발생하는 Bubble의 모델 및 원인에 관한 연구
제우성 동명정보대학교 1999 東明情報大學校論文集 Vol.2 No.-
Silicon wafer direct bonding(SDB) technology allows silicon wafers to stick together without any adhesives and thus has been applied to various field, such as silicon on insulator(SOI) and MEMS applications. The success of SDB technology can be established by bonding on the bonded interface with no defects and preventing intrinsic bubbles in the temperature range of 200∼800℃. In this research, The bonded wafer is achieved in the SiO_2-SiO_2 bonding, which generates no intrinsic bubbles in the annealing under the atmospheric pressure. And, we observe the behavior of the intrinsic bubbles by transmitting the infrared light and the increase of the bubble pressure is found. The intrinsic bubbles are generated in the annealing at around 200℃ in the ultra high vacuum. The experimental result proves the relation between the bubble nucleation and the pressure in the thermodynamic model. It will provide the basis for the annealing process at the low temperature and the control of the intrinsic bubbles in the direct bonding of silicon wafers.
역설계 시스템을 이용한 고속 Air-Blower의 특성 해석
제우성(Woo Seong Che),이동수(Dong Soo Lee),신재진(Jae-Jin Shin),안진우(Jin-Woo Ahn),이동희(Dong-Hee Lee) 대한전기학회 2010 대한전기학회 학술대회 논문집 Vol.2010 No.4
This paper presents a reverse engineering technology for the analysis and design of a high speed air-blower system. The characteristics of air-blower is dependent on a motor and a flow of a impeller. In this paper, a impeller shape and a flow of an air-blower' system are reverse engineered to analyzed the output characteristics. And the results are verified by a practical test. The reverse engineering for an air-blower can be used to improve the performance of blower flow.
제우성(Woo-Seong Che),이동수(Dong-Soo Lee),김정현(Jung Hyun Kim),손을호(Eul-Ho Son),양승용(Seung-Young Yang) 한국자동차공학회 2010 한국자동차공학회 지부 학술대회 논문집 Vol.2010 No.12
External gear pumps are the most widely employed source of power in hydraulic applications, allowing good performance and low manufacturing cost Generally, pumps with involute external gears are most commonly used. The undesired large pressure overshoots or spikes could be excited by virtue of the sudden volumetric change of meshing pockets. In practice, the spikes cause the gear machines to be noisy, inefficient, and have fatigue problems. In order to improve above issue, relief grooves are adopted practically. In this paper, the effects of relief groove configurations are considered by using analysis.
제우성 동명정보대학교 1998 東明情報大學校論文集 Vol.1 No.-
The silicon pendulum with a flexure hinge is designed and fabricated for the servo type accelerometer which is used in INS(Inertial Navigation System). For the INS application, it is essential to measure low-frequency acceleration with high accuracy. Therefore pendulum could be moved easily at small amount of input acceleration. For the purpose, the long type flexure is adapted. To prevent flexures from being buckled, the special arrangement of flexures is designed. And the paper also describes in detail the etching process for fabricating silicon pendulum assembly. The servo type accelerometer with above mentioned silicon pendulum assembly is developed and is carried out static test. The long flexure reduce its stiffness considerably so that a stiffness of 1.6139 N/m is acquired. Static test show a sensitivity threshold of 4.6×10 exp (-6) g and a maximum measurement range of ±24g. These test results shows that the accelerometer presented in this study can be adequately used in precision motion measurement application such as strapdown inertial navigation systems.
관성항법 장치용 Inductance형 가속도계 설계에 관한 연구
제우성,오준호 경북대학교 센서기술연구소 1998 센서技術學術大會論文集 Vol.9 No.1
A precision accelerometer for inertial navigation applications is developed. The low sensitivity threshold and high thermal stability are considered as design parameters. In order to guarantee low sensitivity threshold while maintaining robustness against shock, the push-pull type long flexures are used in this paper. To improve thermal stability, this paper suggests electromagnets as a source of magnetic field and develops the silicon case together with the temperature compensator. The silicon pendulum assembly and the modified inductance type pick-up is also developed to reduce assembling procedure. After assembling the accelerometer, static tests are carried out. Static test show a sensitivity threshold of 4.6X10^(-5)g and a maximum measurement range of ± 24g.
광조형 공정시 휨에 의한 변형을 개선하기 위한 역설계 시스템의 적용
제우성,Che, Woo-Seong 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.4
The slender device(long length and thin width) manufactured by stereolithography process suffers from large curl distortion. This paper adapts two control parameters such as a critical exposure and a penetration depth. The measurement of the test parts dimension are carried out by reverse engineering method with the optical 3-dimensional measurement equipment. We investigate how each parameter contributes to the part accuracy and estimates the optimal set of parameters which minimizes the dimensional error of the test parts. Finally, As being an the RAM slot as being an example of the slender device, the RAM slot is made with the optimal values of control parameter and the results are investigated