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朴春洙,朴修勇,李圭煥 忠南大學校 産業技術硏究所 1990 산업기술연구논문집 Vol.5 No.2
This study presents the results of prediction of rockfill Dam settlements obtained by analysing factotrs influencing Dam settlement. Several predictions such as empirical equations suggested by lawton & lester, Sowers, Soydemir & Kjaernsli, and Speeddie are compared with the observed of settlement for post-construction rockfill Dam. (1) In construction method, dumped rockfill-membrane dam show the highest settlement, compacted rockfill-mmambrane dams show the smallest settlement. (2) Lawton & Lester's equation is considerably fitted with the observed in central core dam but higher than the observed value by 17%. (3) In the case of Sloping core Dam, the predicted in largely, differ from the observed ; Soydemir & Kijaernsli's small than the predicted by 50%, other equation's high than the predicted by 67%. (4) Sower's is very similar with the predicted value of dumped rockfill-membrane dam but higher than the predicted value by 18%. Soydemir & Kjaernsli's equation only agree with compacted rockfill-membrane dam's, other equation's significantly differ from the predicted. (5) The prediction of sttlement by empirical equations cannot use to predict Dam settlmennt without strict classification of dam type so that the equations must be used after deeply consideration of dam type.
PCB 및 패키징 공정에서의 도금 시뮬레이션 기술 적용
이규환,Lee, Kyu Hwan 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.3
Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.