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이억섭(Ouk Sub Lee),허만재(Man Jae Hur),명노훈(No Hoon Myoung),김동혁(Dong Hyeok Kim) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
It is well known that one of the unavoidable trouble factors for the most electronic goods is its on/off switch operation. Most electronic goods are generally known to be suffered by temperature shock due to the switch on/off. When the BGA package is heated by the environmental factors, the failure of solder joint is mainly influenced by the difference in coefficients of thermal expansion (CTE) between the substrate and BGA chips. In this paper, the reliability of lead-free solder used under a boundary condition of many time of changes in temperature is estimated. The BGA daisy-chain specimens consisted of 63Sn-37Pb solder and Sn-Ag-Cu solder balls are packaged onto FR-4 and tested under the accelerated temperature environment. The changes in resistance of terminals of the substrate in the specimens during the thermal impact test of -40℃~125℃ have been measured and the failure mechanism due to the connection damage has been investigated. An analytical aging model is utilized to predict the changes in resistance. Furthermore, the reliability of solder joints has been modeled as a linear fitting of the experimental data by the least-square method.
이억섭(Ouk Sub Lee),허만재(Man Jae Hur),명노훈(No Hoon Myoung),김동혁(Dong Hyeok Kim) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.11
The chip and FR-4 board in electronic goods are generally connected by solder joint. In this case, the difference in coefficients of thermal expansion (CTE) in the chip and FR-4 board generates the shear strains in the solder joint and finally makes the solder joint fail when the chip and FR-4 are heated. The magnitude of shear strain and the final failure are influenced by boundary conditions such as the difference of CTE, the height of solder and the distance of the solder joint from the neutral point (DNP). In this paper, the effects of boundary conditions on the failure probability of solder joint are studied by using the failure probability model with the help of the first order reliability method (FORM). Furthermore, the sensitivity of boundary conditions has been estimated by change of Coefficient of Variation (COV).
FORM과 Monte Carlo Simulation을 이용한 솔더조인트의 신뢰성 평가
이억섭(Ouk Sub Lee),허만재(Man Jae Hur),명노훈(No Hoon Myoung),김동혁(Dong Hyeok Kim) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.8
The chip and FR-4 board in electronic goods are generally connected by solder joint. In this case, the difference in coefficients of thermal expansion (CTE) in the chip and FR-4 board generates the shear strains in the solder joint and finally makes the solder joint fail when the chip and FR-4 are heated. The magnitude of shear strain and the final failure are influenced by boundary conditions such as the difference of CTE, the height of solder and the distance of the solder joint from the neutral point (DNP). In this paper, the effects of boundary conditions on the failure probability of solder joint are studied by using the failure probability model with the help of the first order reliability method (FORM) and the Monte Carlo Simulation (MCS).