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추현수(Chu, Hyun-Soo),장재영(Jang, Jae-Young) SH도시연구원 2017 주택도시연구 Vol.7 No.1
Land donation secures infrastructure, and overcomes the influence caused by sub-development and development of enforcement matters including consideration of indirect return on profits, and it is also a fundamental subject which enhances publicity in the various development projects. However, it is treated one of conventional institutions in public. In particular, due to lack of formation which meets the changing of times in accordance with the adhesion of the system focusing on land donation and proportion of land donation on sites, this is the ongoing controversial subject for broad discussion to find solutions for enhancing publicity. However, devising methods in order to operate the donated facilities efficiently and continuous proper function will be one of important tasks. For publicity measures to promote land-based donation proposed in this study, a management manual, designation of managing body, facilities guidelines, annual evaluation reports according to the monitoring system, etc are regarded as the most fundamental improvements through reorganization for the systematic facilities maintenance.
반도체 배선용 구리 도금층의 미세조직 및 전기비저항 고찰
허석환 ( Seok Hwan Huh ),전형진 ( Hyoung Jin Jeon ),추현수 ( Hyun Soo Chu ),송영석 ( Young Seok Song ),이성근 ( Sung Keun Lee ),이효종 ( Hyo Jong Lee ),이의형 ( Ui Hyoung Lee ) 대한금속재료학회(구 대한금속학회) 2014 대한금속·재료학회지 Vol.52 No.11
Copper electrodeposits annealed at 80 ℃ were investigated by electrical resistance measurement, X-ray diffraction and electron backscattered diffraction analyses. The decrease of electrical resistivity had a linear relationship with the re-crystallized area. Interestingly, the texture coefficient of (200) orientation increased as the re-crystallization occurred. Such appearance of (200) texture during annealing seemed to be related to the residual strain in the copper electrodeposits. It is possible to evaluate the progress of grain growth by measuring the electrical resistivity or texture coefficient in copper electrodeposits. (Received July 23, 2013)